Ukususela kwimbali yophuhliso lwe-chip, isikhokelo sophuhliso lwe-chip sisantya esiphezulu, ukuphindaphinda okuphezulu, ukusetyenziswa kwamandla aphantsi.Inkqubo yokwenziwa kweChip ikakhulu ibandakanya uyilo lwetshiphu, ukwenziwa kwetshiphu, ukwenziwa kokupakishwa, uvavanyo lweendleko kunye namanye amakhonkco, phakathi kwawo inkqubo yokwenziwa kwetshiphu inzima kakhulu.Makhe sijonge inkqubo yokwenziwa kwetshiphu, ngakumbi inkqubo yokwenziwa kwetshiphu.
Eyokuqala luyilo lwetshiphu, ngokweemfuno zoyilo, "ipatheni" eyenziweyo.
1, imathiriyeli ekrwada yewafa yetshiphu
Ukubunjwa kwe-wafer yi-silicon, i-silicon isulungekiswa yisanti yequartz, i-wafer yi-silicon element iyahlanjululwa (99.999%), emva koko i-silicon ecocekileyo yenziwe intonga ye-silicon, ethi ibe yimathiriyeli ye-quartz semiconductor yokwenziwa kwesekethe edibeneyo. , isilayi siyimfuneko ekhethekileyo yewafa yokuvelisa itshiphu.I-wafer ibhityile, iyancipha ixabiso lemveliso, kodwa iphezulu iimfuno zenkqubo.
2.Wafer ukutyabeka
Ingubo ye-wafer inokumelana ne-oxidation kunye nobushushu, kwaye izinto eziphathekayo luhlobo lwe-photoresistance.
3, uphuhliso lwe-wafer lithography, etching
Le nkqubo isebenzisa imichiza ekwaziyo ukumelana nokukhanya kweUV, okuthambisayo.Ubume be-chip bunokufumaneka ngokulawula indawo ye-shading.Iziqwenga ze-silicon zigqunywe ngefotoresist ukuze zinyibilike ekukhanyeni kwe-ultraviolet.Yilapho i-shading yokuqala ingasetyenziswa khona, ukwenzela ukuba inxalenye yokukhanya kwe-UV ichithwe, enokuthi ihlanjwe nge-solvent.Ke intsalela yayo ifana nomthunzi, yile nto siyifunayo.Oku kusinika umaleko wesilica esiwudingayo.
4,Yongeza ukungcola
Ii-ion zifakwe kwi-wafer ukuvelisa i-P kunye ne-N semiconductors ehambelanayo.
Inkqubo iqala ngendawo evulekileyo kwi-silicon wafer kwaye ifakwe kumxube wee-ion zemichiza.Inkqubo iya kutshintsha indlela i-dopant zone iqhuba ngayo umbane, ivumela i-transistor nganye ukuba ivule, ivale okanye iphathe idatha.Iichips ezilula zingasebenzisa umaleko omnye kuphela, kodwa iitshiphusi ezintsonkothileyo zihlala zinemigangatho emininzi, kwaye inkqubo iphindwa ngokuphindaphindiweyo, kunye nemigangatho eyahlukeneyo edityaniswe yifestile evulekileyo.Oku kufana nomgaqo wokuvelisa webhodi ye-PCB yomaleko.Iichips ezintsonkothileyo ngakumbi zinokufuna iileya ezininzi ze-silica, ezinokuthi ziphunyezwe ngokuphindaphindiweyo kwe-lithography kunye nenkqubo engasentla, ukwenza ulwakhiwo olune-dimensional ezintathu.
Uvavanyo lwe-5.Wafer
Emva kweenkqubo ezininzi ezingentla, i-wafer yenza i-lattice yeenkozo.Iimpawu zombane zokhozo ngalunye zavavanywa ngendlela 'yomlinganiselo wenaliti'.Ngokuqhelekileyo, inani leenkozo zetshiphu nganye likhulu, kwaye yinkqubo enzima kakhulu ukuququzelela imowudi yokuvavanya i-pin, efuna ukuveliswa kweemodeli ezinobunzima obufanayo ngexesha lemveliso.Okukhona uphezulu umthamo, kokukhona kusezantsi iindleko ezihambelanayo, esesinye sezizathu zokuba kutheni izixhobo ze-chip eziqhelekileyo zingabizi kakhulu.
6. Ukubethelela
Emva kokuba i-wafer yenziwe, i-pin iyalungiswa, kwaye iifom ezahlukeneyo zokupakisha ziveliswa ngokweemfuno.Esi sizathu sokuba kutheni i-chip core efanayo ingaba neefom zokupakisha ezahlukeneyo.Umzekelo: i-DIP, i-QFP, i-PLCC, i-QFN, njl. Oku kugqitywe ikakhulu yimikhwa yokusetyenziswa kwabasebenzisi, indawo yesicelo, ifom yemarike kunye nezinye izinto ze-peripheral.
7. Uvavanyo kunye nokupakishwa
Emva kokuba le nkqubo ingentla, ukwenziwa kwetshiphu kugqityiwe, eli nyathelo kukuvavanya itshiphu, ukususa iimveliso ezineziphene, kunye nokupakishwa.
Oku ngasentla kumxholo ohambelanayo wenkqubo yokuvelisa i-chip eququzelelwe yi-Create Core Detection.Ndiyathemba ukuba iya kukunceda.Inkampani yethu ineenjineli ezinobuchwephesha kunye neqela le-elite elitekhnoloji, lineelabhoratri ezi-3 ezisemgangathweni, indawo yaselabhoratri ingaphezulu kwe-1800 yeemitha zesikwere, inokwenza uqinisekiso lovavanyo lwezixhobo ze-elektroniki, i-IC eyinyani okanye yobuxoki, ukhetho lwemveliso yoyilo, uhlalutyo lokusilela, uvavanyo lomsebenzi, Ukuhlolwa kwezinto ezingenayo zasefektri kunye netheyiphu kunye nezinye iiprojekthi zovavanyo.
Ixesha lokuposa: Jun-12-2023