Inqaku elinye liyaqonda |Yintoni isiseko sokhetho lwenkqubo yokucubungula umphezulu kwifektri yePCB

• 1. Umoya oshushu usicaba (tshiza inkonkxa)

Inkqubo jikelele yenkqubo yomgangatho womoya oshushu yile: ukhukuliseko oluncinci → ukufudumeza kwangaphambili → ukuthambisa i-welding → fafaza inkonkxa → ukucoca.

Umoya oshushu usicaba, okwaziwa ngokuba ngumoya oshushu odityanisiweyo (owaziwa ngokuba yi-tin spray), leyo yinkqubo yokugquma itoti enyibilikayo (ilothe) edityaniswe kumphezulu wePCB kunye nokusebenzisa ukufudumeza ukucinezela ukulungiswa komoya (ukuvuthela) ukwenza. umaleko we-anti-copper oxidation.Inokubonelela ngemigangatho yokwaleka elungileyo.I-weld yonke kunye nobhedu lomoya oshushu lwenza i-copper-tin metal interductive compound ekudibaneni.PCB idla ngokutshona emanzini anyibilikayo adityanisiweyo;imela yomoya ivuthela ulwelo olululwelwe olusicaba oluludisiweyo phambi kokuba ludityaniswe;

Umgangatho womoya we-thermal wahlulwe waba ziindidi ezimbini: ngokuthe nkqo kunye ne-horizontal.Ngokuqhelekileyo kukholelwa ukuba uhlobo oluthe tye lungcono.Ikakhulu umaleko othe tyaba oshushu wokulungisa umoya uyafana, onokufikelela kwimveliso ezenzekelayo.

Izinto eziluncedo: ixesha elide lokugcina;emva kokuba i-PCB igqityiwe, ubuso bobhedu bumanzi ngokupheleleyo (i-tin ihlanganiswe ngokupheleleyo phambi kwe-welding);ilungele ukuwelda ilothe;inkqubo evuthiweyo, ixabiso eliphantsi, elilungele ukuhlolwa okubonakalayo kunye novavanyo lombane

Ukungalungi: Ayifanelanga ukubopha umgca;ngenxa yengxaki yokuthe tyaba komphezulu, kukwakho nemida kwi-SMT;ayilungelanga uyilo lokutshintsha koqhagamshelwano.Xa utshiza i-tin, ubhedu luya kuchithwa, kwaye ibhodi iqondo lokushisa eliphezulu.Ngokukodwa iipleyiti ezityebileyo okanye ezibhityileyo, isitshizi se-tin silinganiselwe, kwaye umsebenzi wokuvelisa awukho nzima.

• 2, organic weldability protectant (OSP)

Inkqubo eqhelekileyo yile: ukuhlambulula -> i-micro-etching -> pickling -> ukucocwa kwamanzi ahlambulukileyo -> ukugquma kwe-organic -> ukucoca, kunye nokulawulwa kwenkqubo kulula kakhulu ukubonisa inkqubo yonyango.

I-OSP yinkqubo yebhodi yesekethe eprintiweyo (PCB) yonyango lwe-foil yobhedu ngokuhambelana neemfuno zomyalelo we-RoHS.I-OSP imfutshane kwi-Organic Solderability Preservatives, ekwaziwa ngokuba zizithinteli ze-organic solderability, ezikwaziwa njenge-Preflux ngesiNgesi.Ngamafutshane, i-OSP yifilimu yolusu ekhule ngokwekhemikhali kwindawo ecocekileyo, engenanto yobhedu.Le filimu ine-anti-oxidation, ukutshatyalaliswa kobushushu, ukuxhathisa ukufuma, ukukhusela ubuso bobhedu kwindawo eqhelekileyo ayisekho i-rust (i-oxidation okanye i-vulcanization, njl.);Nangona kunjalo, kwi-welding elandelayo yobushushu obuphezulu, le filimu ekhuselayo kufuneka isuswe ngokulula yi-flux ngokukhawuleza, ukwenzela ukuba indawo evezwe yobhedu ecocekileyo inokudibaniswa ngokukhawuleza kunye ne-solder etyhidiweyo ngexesha elifutshane kakhulu ukuba ibe yinto edibeneyo ye-solder.

Izinto eziluncedo: Inkqubo ilula, umphezulu uthe tyaba kakhulu, ufanelekile kwi-welding engena-lead kunye ne-SMT.Kulula ukuphinda usebenze, ukusebenza kwemveliso efanelekileyo, ilungele ukusebenza komgca othe tye.Ibhodi ilungele ukusetyenzwa okuninzi (umz. OSP+ENIG).Iindleko eziphantsi, zihambelana nokusingqongileyo.

Ukungalungi: ukulinganiselwa kwenani le-welding ye-reflow (i-welding eninzi, ifilimu iya kutshatyalaliswa, ngokusisiseko amaxesha ama-2 akukho ngxaki).Ayifanelekanga iteknoloji yecrimp, ukubopha ucingo.Ukubona okubonakalayo kunye nokufunyanwa kombane akulula.Ukhuseleko lwegesi ye-N2 luyafuneka kwi-SMT.Ukusebenza kwakhona kwe-SMT akufanelekanga.Iimfuno eziphezulu zokugcina.

• 3, ipleyiti yonke yalekwe ngegolide yenikeli

I-Plate nickel plating yi-PCB umphezulu we-conductor kuqala watyatyiswa ngomaleko we-nickel emva koko watyatyathwa ngomaleko wegolide, ukufakwa kwe-nickel kukuthintela ukusasazwa phakathi kwegolide nobhedu.Kukho iintlobo ezimbini zegolide ye-nickel ene-electroplated: igolide ethambileyo (igolide esulungekileyo, umphezulu wegolide awubonakali uqaqambile) kunye negolide enzima (umphezulu ogudileyo nolukhuni, ongagugiyo, okwaziyo ukunxiba, oqulathe ezinye izinto ezinjengecobalt, umphezulu wegolide ubonakala uqaqambile).Igolide ethambileyo isetyenziselwa ikakhulu ukupakishwa kwetshiphu ucingo lwegolide;Igolide elukhuni isetyenziswa ikakhulu kunxibelelwano lombane olungadityaniswanga.

Izinto eziluncedo: Ixesha elide lokugcina > iinyanga ezili-12.Ifanelekile kuyilo lokutshintsha koqhagamshelwano kunye nokubopha ucingo lwegolide.Ifanelekile ukuvavanywa kombane

Ubuthathaka: Iindleko eziphezulu, igolide engqindilili.Iminwe ene-electroplated idinga ukuqhutywa kocingo olongezelelweyo.Ngenxa yokuba ubukhulu begolide abuhambisani, xa isetyenziswe kwi-welding, inokubangela ukuxutywa kwe-solder joint ngenxa yegolide eninzi, echaphazela amandla.Ingxaki yokufana komphezulu we-Electroplating.Igolide ye-nickel ene-electroplated ayiwugubungeli umda wocingo.Ayifanelanga ukudityaniswa kocingo lwe-aluminiyam.

• 4. Tshini igolide

Inkqubo eqhelekileyo yile: ukucocwa kwe-pickling -> i-micro-corrosion -> i-preleaching -> ukusebenza -> i-electroless nickel plating -> i-chemical gold leaching;Kukho amatanki emichiza ayi-6 kule nkqubo, ebandakanya phantse iintlobo ezili-100 zeekhemikhali, kwaye inkqubo inzima ngakumbi.

Igolide ezikayo isongelwe engqindilili, ngombane elungileyo nickel ingxubevange yegolide kumphezulu wobhedu, enokukhusela PCB ixesha elide;Ukongezelela, ikwanayo nokunyamezela kokusingqongileyo ukuba ezinye iinkqubo zonyango ezingaphezulu azikho.Ukongeza, ukutshona kwegolide kunokuthintela ukuchithwa kobhedu, okuya kuzuza indibano engenalo ilothe.

Izinto eziluncedo: akukho lula ukufakwa kwi-oxidize, inokugcinwa ixesha elide, umphezulu usicaba, ulungele ukuwelda izikhonkwane ze-gap ezintle kunye namacandelo anamalungu amancinci e-solder.Ibhodi yePCB ekhethwayo enamaqhosha (afana nebhodi yefowuni ephathwayo).I-welding ye-reflow inokuphinda iphindwe kaninzi ngaphandle kokulahlekelwa kakhulu kwe-weldability.Ingasetyenziselwa njengesiseko sezinto zeCOB (Chip On Board) i-wiring.

Ukungalungi: ixabiso eliphezulu, amandla amabi we-welding, kuba ukusetyenziswa kwenkqubo ye-nickel engeyona i-electroplated, kulula ukuba neengxaki zediski ezimnyama.Umaleko we-nickel oxidizes ngokuhamba kwexesha, kwaye ukuthembeka kwexesha elide kungumba.

• 5. Itoti ezikayo

Ekubeni zonke ii-solders zangoku zisekelwe kwi-tin, umaleko we-tin unokuhambelana naluphi na uhlobo lwe-solder.Inkqubo yokucwila i-tin inokwenza i-copper-tin metal intermetallic compounds, eyenza i-tin ezikayo ibe ne-solderability efanayo kunye nomgangatho womoya oshushu ngaphandle kwentloko ingxaki ethe tyaba yomgangatho womoya oshushu;I-plate ye-tin ayikwazi ukugcinwa ixesha elide, kwaye indibano kufuneka iqhutywe ngokomyalelo wokucwiliswa kwe-tin.

Izinto eziluncedo: Ifanelekile kwimveliso yomgca othe tye.Ifanelekile ukucutshungulwa komgca ococekileyo, ofanelekileyo kwi-lead-free welding, ngokukodwa ifanelekile kwi-teknoloji ye-crimping.I-flatness entle kakhulu, ifanelekile kwi-SMT.

Ukungalungi: Kuyafuneka iimeko zokugcinwa kakuhle, kubhetele zingabi ngaphezu kweenyanga ezi-6, ukulawula ukukhula kwebhobhobhobhoyi.Ayilunganga uyilo lokutshintsha koqhagamshelwano.Kwinkqubo yokuvelisa, inkqubo yefilimu yokumelana ne-welding iphezulu, ngaphandle koko iya kubangela ukuba ifilimu yokumelana ne-welding iwele.Kwi-welding ezininzi, ukhuseleko lwegesi ye-N2 lungcono.Umlinganiselo wombane uyingxaki.

• 6. Isilivere etshonayo

Inkqubo yokutshona kwesilivere iphakathi kokwaleka kwe-organic kunye ne-electroless nickel / plating yegolide, inkqubo ilula kwaye iyakhawuleza;Naxa evezwe kubushushu, ukufuma kunye nongcoliseko, isilivere isakwazi ukugcina i-weldability entle, kodwa iya kuphulukana nokubengezela kwayo.ISilver plating ayinawo amandla afanelekileyo enziwe nge-electroless nickel plating/plating yegolide kuba akukho nickel ngaphantsi komgangatho wesilivere.

Izinto eziluncedo: Inkqubo elula, ilungele i-lead-free welding, i-SMT.Umphezulu othe tyaba kakhulu, ixabiso eliphantsi, elilungele imigca emihle kakhulu.

Ukungalungi: Iimfuno eziphezulu zokugcina, kulula ukungcolisa.Amandla e-welding axhomekeke kwiingxaki (ingxaki ye-micro-cavity).Kulula ukuba ne-electromigration phenomenon kunye neJavani bite phenomenon yobhedu phantsi kwefilimu yokumelana ne-welding.Umlinganiselo wombane uyingxaki

• I-7, ikhemikhali ye-nickel palladium

Xa kuthelekiswa nemvula yegolide, kukho umaleko owongezelelweyo wepalladium phakathi kwenickel negolide, kwaye i-palladium inokuthintela ukwenzeka kwe-corrosion ebangelwa kukutshintsha kwezinto kwaye yenze amalungiselelo apheleleyo okuna kwegolide.Igolide idityaniswe ngokusondeleyo ne-palladium, inika indawo yokunxibelelana kakuhle.

Izinto eziluncedo: Ilungele ukuwelda simahla.Umphezulu othe tyaba, olungele i-SMT.Ngemingxuma ingaba yigolide ye-nickel.Ixesha elide lokugcina, iimeko zokugcina azikho nzima.Ifanelekile ukuvavanywa kombane.Ifanelekile kuyilo loqhagamshelwano lokutshintsha.Ilungele ukubopha ucingo lwe-aluminiyam, ilungele ipleyiti eshinyeneyo, ukuxhathisa okuqinileyo kuhlaselo lokusingqongileyo.

• 8. Electroplating igolide eqinileyo

Ukuze kuphuculwe ukuxhatshazwa kokugqoka kwemveliso, ukwandisa inani lokufakwa kunye nokususwa kunye ne-electroplating yegolide enzima.

Utshintsho lwenkqubo yonyango lwe-PCB alukho lukhulu kakhulu, lubonakala luyinto ekude, kodwa kufuneka kuqatshelwe ukuba utshintsho olucothayo lwexesha elide luya kukhokelela kutshintsho olukhulu.Kwimeko yokunyuka kweefowuni zokukhusela indalo, inkqubo yonyango ye-PCB ngokuqinisekileyo iya kutshintsha kakhulu kwixesha elizayo.