Inkonzo ye-OEM PCBA Clone yeNdibano Enye i-PCB kunye ne-PCBA ye-Electronics yesiko i-PCB yeBhodi yeSekethe eFakelweyo

OEM PCBA Clone Inkonzo yeNdibano Enye PCB & PCBA Custom Electronics PCB Ibhodi yeSekethe

Inkcazelo emfutshane:

Isicelo: I-Aerospace, BMS, uNxibelelwano, iKhompyutha, i-Electronics yabathengi, isixhobo sasekhaya, i-LED, izixhobo zonyango, i-Motherboard, i-Smart electronics, ukutshaja okungenazintambo

Uphawu:I-PCB enokufikeleleka, iPCB yoxinaniso oluphezulu

Izinto zokugquma: I-Epoxy Resin, i-Metal Composite Materials, i-Organic Resin

Material: IAluminiyam egqunywe ngeFoil yeCopper, iComplex, iFiberglass Epoxy, iFiberglass Epoxy Resin & Polyimide Resin, iPhenolic yeFoil yeCopper Substrate yePhenolic, iSynthetic Fiber

ITekhnoloji yokucubungula:I-Foil yoxinzelelo lwe-Delay, i-Electrolytic Foil

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Inkcazo

UbuGcisa bePCB

Iileya Imveliso yobuninzi: I-2 ~ 58 imigangatho / Umqhubi we-Pilot: i-64 layers

Max. Ukutyeba Ukuveliswa kweMisa: 394mil (10mm) / Ukuqhuba umqhubi: 17.5mm

Materials FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic ezaliswe, Teflon, Polyimide, BT,PPO,PPE, Hybrid, Partial hybrid, njl.

Min. Ububanzi/Isithuba Umaleko wangaphakathi: 3mil/3mil (HOZ), Umaleko wangaphandle: 4mil/4mil(1OZ)

Max. Ukutyeba kobhedu 6.0 OZ / Umqhubi wePilot: 12OZ

Min. Ubungakanani boMngxuma woKwenziwa koomatshini: 8mil(0.2mm) I-Laser drill: 3mil(0.075mm)

Umphezulu wokuGqibela i-HASL, iGolide yokuntywiliselwa, iTin yokuntywiliselwa, i-OSP, i-ENIG + OSP, ukuntywiliselwa, i-ENEPIG, uMnwe weGolide

Inkqubo eKhethekileyo eGqwetshwe umngxuma, umngxuma oyimfama, ukuxhathisa okuThunyiweyo, amandla oThunyiweyo, iHybrid, i-hybride engaphelelanga, ingxinano ephezulu, ukugrumba ngasemva, kunye nolawulo lokuxhathisa

PCBA Ubuchule bobugcisa

Izinto eziluncedo---Ubuchwephesha bokunyuswa komphezulu kunye nobuchwepheshe bokuthengisa ngomngxuma

----Ubukhulu obahlukeneyo njenge-1206,0805,0603 yamacandelo eteknoloji ye-SMT

----ICT(Kuvavanyo lweSekethe),FCT(Uvavanyo lweSekethe olusebenzayo)

----INdibano yePCB ene-UL,CE,FCC,Imvume yeRohs

----Ubuchwephesha bokuthengiswa kwegesi ye-nitrojeni yokuphinda kuqukunjelwe kwi-SMT.

----UmGangatho oPhezulu we-SMT&Umgca weNdibano yeSolder

----Uxinaniso oluphezulu oludityanisiweyo lwetekhnoloji yokubeka ibhodi.

Amacandelo Passive Phantsi ukuya 0201 ubukhulu, BGA kunye VFBGA, Leadless Chip Abathwali / CSP

INdibano ye-SMT enamacala amabini, i-Fine Pitch ukuya kwi-0.8mils, ukulungiswa kwe-BGA kunye ne-Reball

UVavanyo lwe-Flying Probe, uvavanyo lwe-X-reyi yoHlolo lwe-AOI

SMT Isikhundla ukuchaneka	20 um
Ubungakanani bamacandelo	0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP
Max. ubude becandelo	25mm
Max. Ubungakanani bePCB	680×500mm
Min. Ubungakanani bePCB	akukho mda
PCB ubukhulu	0.3 ukuya 6mm
I-Wave-Solder Max. PCB ububanzi	450mm
Min. PCB ububanzi	akukho mda
Ubude becandelo	Phezulu 120mm/Bot 15mm
Umbilo-Solder uhlobo Metal	inxalenye, yonke, inlay, sidestep
Izinto zentsimbi	Ubhedu, iAluminiyam
Umphezulu Gqiba	plating Au, , plating Sn
Umoya wesinyi	ngaphantsi kwe 20%
Cinezela-faka Uluhlu lweCofa	0-50KN
Max. Ubungakanani bePCB	800X600mm