Ubunzima bubonke kunye nenani leeleya zebhodi ye-PCB ye-multilayer ilinganiselwe ngeempawu zebhodi ye-PCB. Iibhodi ezikhethekileyo zilinganiselwe kubukhulu bebhodi ezinokubonelelwa, ngoko ke umyili kufuneka aqwalasele iimpawu zebhodi yenkqubo yoyilo lwe-PCB kunye nokunciphisa iteknoloji yokucubungula i-PCB.
Iinkqubo zokunyanzeliswa kwenkqubo yolwaleko oluninzi
I-Laminating yinkqubo yokudibanisa umaleko ngamnye webhodi yesekethe ibe yinto yonke. Yonke le nkqubo ibandakanya uxinzelelo kiss, uxinzelelo olupheleleyo kunye noxinzelelo olubandayo. Ngexesha lokucinezela i-kiss, i-resin ingena kwi-bonding surface kwaye igcwalise i-voids kumgca, emva koko ingena ngokucofa ngokupheleleyo ukubopha zonke i-voids. Okubizwa ngokuba yi-cold pressing kukupholisa ibhodi yesiphaluka ngokukhawuleza kwaye ugcine ubungakanani buzinzile.
inkqubo Laminating kufuneka ingqalelo imiba, okokuqala kuzo zonke kuyilo, kufuneka ukuhlangabezana neemfuno ibhodi engundoqo yangaphakathi, ubukhulu becala ubukhulu, ubukhulu imilo, umngxuma indawo, njl, kufuneka ukuba ziyilwe ngokungqinelana neemfuno ezithile, iimfuno ibhodi engundoqo yangaphakathi ngokubanzi akukho evulekileyo, emfutshane, evulekileyo, akukho oxidation, akukho film intsalela.
Okwesibini, xa u-laminating iibhodi ezininzi, iibhodi ezingundoqo zangaphakathi kufuneka ziphathwe. Inkqubo yonyango ibandakanya unyango lwe-oxidation emnyama kunye nonyango lwe-Browning. Unyango lwe-oxidation kukwenza ifilimu ye-oxide emnyama kwi-foil yobhedu yangaphakathi, kwaye unyango olumdaka kukwenza ifilimu ephilayo kwi-foil yobhedu yangaphakathi.
Ekugqibeleni, xa i-laminating, kufuneka sinikele ingqalelo kwimibandela emithathu: ubushushu, uxinzelelo kunye nexesha. Ubushushu bubhekisa ikakhulu kwiqondo lobushushu lokunyibilika kunye nobushushu bokunyanga be-resin, ubushushu obumiselweyo bepleyiti eshushu, ubushushu bokwenyani bezinto kunye nokutshintsha kwezinga lokufudumeza. Ezi parameters zifuna ingqalelo. Ngokuphathelele uxinzelelo, umgaqo osisiseko kukugcwalisa i-interlayer cavity kunye ne-resin ukukhupha iigesi ze-interlayer kunye ne-volatiles. Iiparamitha zexesha zilawulwa ngokuyintloko ngexesha loxinzelelo, ixesha lokufudumeza kunye nexesha le-gel.
Ixesha lokuposa: Feb-19-2024
