1. Iimfuno zembonakalo kunye nokusebenza kombane
Eyona mpembelelo intuitive of ezingcolisa PCBA yinkangeleko PCBA. Ukuba ibekwe okanye isetyenziswe kwindawo yobushushu obuphezulu kunye nokufuma, kunokubakho ukufunxa ukufuma kunye nentsalela emhlophe. Ngenxa yokusetyenziswa ngokubanzi chips leadless, micro-BGA, chip-level package (CSP) kunye 0201 amacandelo kumacandelo, umgama phakathi amacandelo kunye nebhodi ukuncipha, ubungakanani ibhodi iya isiba ncinci, kwaye ingxinano yendibano. ukwanda. Enyanisweni, ukuba i-halide ifihliwe phantsi kwecandelo okanye ayikwazi ukucocwa nonke, ukucocwa kwendawo kunokukhokelela kwimiphumo emibi ngenxa yokukhululwa kwe-halide. Oku kunokubangela ukukhula kwe-dendrite, okunokukhokelela kwiisekethe ezimfutshane. Ukucocwa ngokungafanelekanga kwezinto ezingcolileyo ze-ion kuya kukhokelela kwiingxaki ezininzi: ukumelana nomgangatho ophantsi, ukubola, kunye ne-conductive surface residues kuya kwenza i-dendritic distribution (dendrites) ebusweni bebhodi yesiphaluka, okubangelwa isiphaluka esifutshane sendawo, njengoko kuboniswe kumfanekiso.
Ezona zoyikiso ziphambili ekuthembekeni kwezixhobo ze-elektroniki zomkhosi ngamabhovu enkcenkce kunye neentsimbi ezidityanisiweyo. Ingxaki isaqhubeka. I-whiskers kunye ne-metal intercompounds ekugqibeleni ziya kubangela isiphaluka esifutshane. Kwiindawo ezinomswakama kunye nombane, ukuba kukho ukungcoliswa kwe-ion eninzi kumacandelo, kunokubangela iingxaki. Umzekelo, ngenxa yokukhula kwamabhobho enkcenkce ee-electrolytic, ukubola kwee-conductors, okanye ukuncitshiswa kokunganyangeki kokugquma, i-wiring kwibhodi yesekethe iya kuba mfutshane, njengoko kubonisiwe kumfanekiso.
Ukucocwa ngokungafanelekanga kwezinto ezingcolisa i-non-ionic kunokubangela uthotho lweengxaki. Inokubangela ukuncamatheliswa kakubi kwemaski yebhodi, udibaniso olulambathayo lwephini yesiqhagamshelo, ukuphazamiseka komzimba okulambathayo, kunye nokuncamathela okulambathayo kwengubo ehambelanayo kwiindawo ezihambayo kunye neeplagi. Ngexesha elifanayo, i-non-ionic contaminants inokuphinda ifake i-ionic contaminants kuyo, kwaye inokuthi ifake kwaye ithwale ezinye iintsalela kunye nezinye izinto ezinobungozi. Le yimiba engenakuhoywa.
2, Three anti-ipeyinti ukutyabeka iimfuno
Ukwenza i-coating ithembekile, ukucoceka komphezulu we-PCBA kufuneka kuhlangabezane neemfuno ze-IPC-A-610E-2010 inqanaba le-3 standard. I-resin ye-resin engacocwanga phambi kokuba i-surface coating inokubangela ukuba umaleko wokukhusela uhlambuluke, okanye umaleko okhuselayo uqhekeke; Intsalela ye-activator inokubangela ukufuduka kwe-electrochemical phantsi kwengubo, okubangela ukungaphumeleli kokukhusela ukuphulwa kwengubo. Uphononongo lubonise ukuba izinga lokudibanisa i-coating linganyuswa nge-50% ngokucoca.
3, No Ukucoca nako kufuna ukucocwa
Ngokwemigangatho yangoku, igama elithi "akukho-clean" lithetha ukuba iintsalela ebhodini zikhuselekile ngokwekhemikhali, aziyi kuba nayiphi na impembelelo ebhodini, kwaye zingahlala ebhodini. Iindlela zokuvavanya ezikhethekileyo ezifana nokufumanisa i-corrosion, ukumelana ne-surface insulation (SIR), i-electromigration, njl. Nangona kunjalo, nokuba i-flux engacocekanga enomxholo ophantsi oqinileyo iyasetyenziswa, kuya kuhlala kukho intsalela eninzi okanye encinci. Kwiimveliso ezineemfuno ezithembekileyo eziphezulu, akukho ntsalela okanye ezinye izinto ezingcolileyo ezivunyelwe kwibhodi yesiphaluka. Kwizicelo zasemkhosini, kwanezinto ze-elektroniki ezicocekileyo ezingacocekanga ziyafuneka.
Ixesha lokuposa: Feb-26-2024
