Ufakelo oluchanekileyo noluchanekileyo lwamacandelo adityaniswe phezulu kwindawo esisigxina ye-PCB yeyona njongo iphambili yokusetyenzwa kwepetshi ye-SMT. Nangona kunjalo, kwinkqubo yokucutshungulwa, kuya kubakho iingxaki ezithile, eziza kuchaphazela umgangatho wepatch, phakathi kwayo eyona nto ixhaphakileyo yingxaki yokufuduswa kwecandelo.
Izizathu ezahlukeneyo zokutshintsha ukupakishwa ziyohluka kwizizathu eziqhelekileyo
(1) Isantya somoya we-welding welding sikhulu kakhulu (ikakhulukazi senzeka kwiziko le-BTU, amacandelo amancinci naphezulu kulula ukuwatshintsha).
(2) Ukungcangcazela komzila kaloliwe wothutho, kunye nentshukumo yothutho lwesixhobo sokuxhomisa (amacandelo anzima)
(3) Uyilo lwephedi luyi-asymmetrical.
(4) Ukuphakanyiswa kwephedi yobungakanani obukhulu (SOT143).
5 Unyamezelo lwaloo macandelo, anje ngeSIM khadi, iipads okanye steel mesh Windows kufuneka ibe ngaphantsi kobubanzi bepin yecandelo kunye ne-0.3mm.
(6) Imilinganiselo yeziphelo zombini zamacandelo yahlukile.
(7) Amandla angalinganiyo kumalungu, anje ngepakethe yokuchasa ukumanzisa, umngxuma wokumisa okanye ufakelo lwekhadi lokufakela.
(8) Ecaleni kwamacandelo athanda ukukhupha, njenge tantalum capacitors.
(9) Ngokuqhelekileyo, i-solder paste enomsebenzi onamandla akulula ukuyitshintsha.
(10) Nayiphi na into enokubangela ikhadi elimileyo liya kubangela ukufuduswa.
Ngezizathu ezithile:
Ngenxa ye-welding reflow, icandelo libonisa imeko edadayo. Ukuba indawo echanekileyo iyafuneka, lo msebenzi ulandelayo kufuneka wenziwe:
(1) Ushicilelo lwe-solder paste kufuneka luchaneke kwaye ubukhulu befestile yentsimbi yomnatha akufunekanga bube ngaphezu kwe-0.1mm ububanzi kunephini lecandelo.
(2) Yila ngokufanelekileyo ipad kunye nendawo yokufakela ukuze amacandelo alungelelaniswe ngokuzenzekelayo.
(3) Xa kuyilwa, umsantsa phakathi kwamalungu olwakhiwo kwaye kufuneka lwandiswe ngokufanelekileyo.
Ixesha lokuposa: Mar-08-2024
