Izizathu ze-SMT welding
1. PCB iphedi uyilo iziphene
Kwinkqubo yoyilo lwe-PCB ethile, ngenxa yokuba isithuba sincinci, umngxuma unokudlalwa kuphela kwi-pad, kodwa i-solder paste ine-fluidity, enokuthi ingene emngxunyeni, okubangela ukungabikho kwe-solder paste kwi-welding reflow, ke xa isikhonkwane singonelanga ukutya inkonkxa, kuya kukhokelela kwiwelding ebonakalayo.
2.I-Pad surface oxidation
Emva kokuphinda kufakwe i-pad oxidized, i-welding ye-reflow iya kukhokelela kwi-welding ebonakalayo, ngoko xa i-pad i-oxidize, kufuneka yomiswe kuqala. Ukuba i-oxidation inzulu, kufuneka iyekwe.
Ukushisa kwe-3.Reflow okanye ixesha lobushushu bommandla ophezulu akwanele
Emva kokuba isiqwenga sigqityiwe, iqondo lobushushu alanelanga xa udlula kwindawo yokufudumeza i-reflow preheating zone kunye neqondo lobushushu elingaguqukiyo, nto leyo ekhokelela ekubeni enye inyibilika inyibilike inyibilika engazange yenzeke emva kokungena kwindawo yobushushu obuphezulu, nto leyo ekhokelela ekutyeni okungonelanga kwetoti. yephini yecandelo, ekhokelela kwi-welding ebonakalayo.
4.I-Solder yokuprinta i-paste ingaphantsi
Xa i-solder paste ihlanjululwa, inokuba ngenxa yokuvuleka okuncinci kwi-mesh yentsimbi kunye noxinzelelo olugqithisileyo lwe-scraper yokushicilela, okukhokelela ekushicileleni kwe-solder paste kunye nokuguquguquka okukhawulezileyo kwe-solder paste ye-welding reflow, ekhokelela kwi-welding virtual.
Izixhobo ze-5.High-pin
Xa isixhobo se-high-pin siyi-SMT, mhlawumbi ngenxa yesizathu esithile, icandelo likhubazekile, ibhodi ye-PCB igobile, okanye uxinzelelo olubi lomatshini wokubeka alunelanga, okukhokelela ekunyibilikeni okushushu okuhlukeneyo kwe-solder, okukhokelela ekubeni welding virtual.
Izizathu ze-DIP ze-welding virtual
1.PCB plug-in umngxuma iziphene uyilo
I-PCB plug-in umngxuma, ukunyamezelana kuphakathi kwe-± 0.075mm, umngxuma wokupakisha we-PCB mkhulu kune-pin yesixhobo somzimba, isixhobo siya kuba sikhululekile, kubangele i-tin eyaneleyo, i-welding ebonakalayo okanye i-welding yomoya kunye nezinye iingxaki zomgangatho.
2.I-Pad kunye ne-oxidation yomngxuma
PCB imingxunya pad ayihlambulukanga, oxidized, okanye zingcoliswe izinto ezibiweyo, igrisi, amabala umbilo, njl, nto leyo eya kukhokelela weldability kakubi okanye non-weldability, okukhokelela ukuwelda virtual kunye nokuwelda emoyeni.
3.PCB ibhodi kunye nezinto umgangatho isixhobo
Iibhodi PCB ezithengiweyo, amacandelo kunye nezinye solderability ayifanelekanga, akukho uvavanyo engqongqo ukwamkelwa sele yenziwe, kwaye kukho iingxaki ezisemgangathweni ezifana ukuwelda virtual ngexesha indibano.
Ibhodi ye-4.PCB kunye nesixhobo siphelelwe lixesha
Iibhodi zePCB ezithengiweyo kunye namacandelo, ngenxa yexesha le-inventri lide kakhulu, elichatshazelwa yimeko yendawo yokugcina impahla, efana nobushushu, ukufuma okanye iigesi ezidliwayo, okukhokelela kwiziganeko ze-welding ezifana ne-welding virtual.
5.Wave izinto zokuthambisa izixhobo
Ubushushu obuphezulu kwisithando somlilo se-welding bukhokelela kwi-oxidation ekhawulezileyo yezinto ze-solder kunye nomphezulu wezinto ezisisiseko, okukhokelela ekunciphiseni ukunamathela komphezulu kwizinto eziphathekayo ze-solder. Ngaphezu koko, ubushushu obuphezulu buphinde budle umphezulu orhabaxa wesiseko, nto leyo ekhokelela ekuncitshisweni kwesenzo se-capillary kunye nokungasebenzi kakuhle, okukhokelela kwi-welding ebonakalayo.
Ixesha lokuposa: Jul-11-2023
