I-PCB ye-multilayer compaction yinkqubo elandelelanayo. Oku kuthetha ukuba isiseko sokubeka iya kuba sisiqwenga sefoyile yobhedu kunye nomaleko we-prepreg obekwe ngaphezulu. Inani leeleya ze-prepreg liyahluka ngokweemfuno zokusebenza. Ukongeza, i-internal core ifakwe kwi-prepreg billet layer kwaye emva koko izaliswe ngumaleko we-billet we-prepreg ogqunywe ngefoyile yobhedu. I-laminate ye-PCB ye-multi-layer yenziwa njalo. Beka i-laminates ezifanayo phezu komnye. Emva kokuba ifoyile yokugqibela yongeziwe, isitakhi sokugqibela senziwe, esibizwa ngokuba “yincwadi,” kwaye isitaki ngasinye sibizwa ngokuba “sisahluko.”
Xa incwadi igqityiwe, idluliselwa kumatshini wokushicilela owenziwe ngehydraulic. Umshicileli we-hydraulic ushushu kwaye usebenzisa inani elikhulu loxinzelelo kunye ne-vacuum kwincwadi. Le nkqubo ibizwa ngokuba kukuphilisa kuba inqanda unxibelelwano phakathi kwe-laminates kunye nomnye kwaye ivumela i-resin prepreg ukuba idibanise nombindi kunye ne-foil. Amacandelo ke ayasuswa kwaye apholiswe kwiqondo lobushushu begumbi ukuvumela i-resin ukuba izinze, ngaloo ndlela igqibezela ukuveliswa kobhedu lwe-PCB yee-multilayer.
Emva kokuba amaphepha ahlukeneyo ezinto ezikrwada zisikwe ngokobukhulu obuchaziweyo, inani elahlukileyo lamaphepha likhethwa ngokobunzima bephepha ukwenza i-slab, kwaye i-slab elaminethiweyo idityaniswe kwiyunithi yokucinezela ngokulandelelana kweemfuno zenkqubo. . Tyhiliza iyunithi ecinezelayo kumatshini wokulayita ukuze ucinezele kwaye wenze.
Izigaba ezi-5 zokulawula ubushushu
(a) Inqanaba lokufudumeza: iqondo lobushushu lisuka kwiqondo lobushushu begumbi ukuya kwiqondo lokuqala lobushushu bomphezulu wonyango, ngelixa i-resin engundoqo ishushu, inxenye yee-volatiles iyakhutshwa, kwaye uxinzelelo yi-1/3 ukuya kwi-1/2 uxinzelelo olupheleleyo.
(b) Inqanaba lokugquma: intlaka yomphezulu iphiliswa ngesantya esisezantsi sokusabela. I-core layer resin ifudunyezwa ngokulinganayo kwaye inyibilike, kwaye i-interface ye-resin layer iqala ukuxubana enye kwenye.
(c) inqanaba lokufudumeza: ukusuka kwiqondo lokushisa lokuqala lokunyanga ukuya kubushushu obuphezulu obuchaziweyo ngexesha lokucinezela, isantya sokufudumeza akufuneki sikhawuleze kakhulu, kungenjalo isantya sokunyanga somgangatho ophezulu siya kukhawuleza kakhulu, kwaye asinakudityaniswa kakuhle i-resin ye-core layer, ebangela ukuba i-stratification okanye ukuqhekeka kwemveliso egqityiweyo.
D indibaniselwano phakathi kwamaleko amaxwebhu izinto, phantsi kwesenzo soxinzelelo ukwenza iyunifomu eshinyeneyo ngokupheleleyo, kwaye emva koko ukusebenza kwemveliso egqityiweyo ukufezekisa ixabiso elingcono.
(e) Inqanaba lokupholisa: Xa i-resin yomgangatho ophakathi we-slab iphilisiwe kwaye idityaniswe ngokupheleleyo ne-core layer resin, inokupholiswa kwaye ipholiswe, kwaye indlela yokupholisa kukudlulisa amanzi okupholisa kwipleyiti eshushu. yoshicilelo, enokuthi kwakhona ipholiswe ngokwemvelo. Eli nqanaba kufuneka lenziwe phantsi kokugcinwa koxinzelelo oluchaziweyo, kwaye izinga lokupholisa elifanelekileyo kufuneka lilawulwe. Xa ukushisa kweplate kwehla ngaphantsi kweqondo lokushisa elifanelekileyo, ukukhutshwa koxinzelelo kunokwenziwa.
Ixesha lokuposa: Mar-07-2024
