Iindidi ezininzi zemveliso yemathiriyeli ekrwada zisetyenziswa kwi-SMT patch processing. I-tinnote yeyona ibaluleke ngakumbi. Umgangatho we-tin intlama uya kuchaphazela ngokuthe ngqo umgangatho we-welding we-SMT patch processing. Khetha iintlobo ezahlukeneyo ze-tinnuts. Mandikwazise ngokufutshane ulwahlulo oluqhelekileyo lwencama yetoti:
I-Weld paste luhlobo lwe-pulp yokuxuba i-weld powder kunye ne-agent-efana ne-welding agent (i-rosin, i-diluent, i-stabilizer, njl.) kunye nomsebenzi odibeneyo. Ngokobunzima, i-80 ~ 90% yi-alloys yensimbi. Ngokumalunga nomthamo, isinyithi kunye ne-solder zibalelwa kwi-50%.
Umfanekiso 3 Ishumi leegranuli zokucola (SEM) (ekhohlo)
Umzobo 4 Umzobo okhethekileyo wenkcenkce yesigqubuthelo somphezulu somgubo (ekunene)
I-solder paste ngumthuthi we-tin powder particles. Ibonelela ngeyona ndlela ifanelekileyo yokwehla kokuhamba kunye nokufuma ukukhuthaza ukuhanjiswa kobushushu kwindawo ye-SMT kunye nokunciphisa ukunyanzeliswa komphezulu wolwelo kwi-weld. Izithako ezahlukeneyo zibonisa imisebenzi eyahlukeneyo:
① Isinyibilikisi:
I-solvent yesi sithako se-weld ingredient ine-uniform adjustment yokulungelelanisa ngokuzenzekelayo kwinkqubo yokusebenza ye-tin paste, enempembelelo enkulu kubomi be-weld paste.
② Intlaka:
Idlala indima ebalulekileyo ekwandiseni ukunamathela kwi-tin paste kunye nokulungisa nokuthintela i-PCB ekuphindeni i-oxidation emva kwe-welding. Esi sithako esisisiseko sinendima ebalulekileyo ekulungisweni kwamalungu.
③ Isixhobo:
Idlala indima yokususa izinto ezixutywe ne-oxidized ye-PCB yobhedu ye-copper surface layer kunye ne-SMT patch site, kwaye inesiphumo sokunciphisa ukuxinana komphezulu we-tin kunye nolwelo olulothe.
④ Intente:
Ukulungiswa ngokuzenzekelayo kwe-viscosity ye-weld paste idlala indima ebalulekileyo ekushicileleni ukuthintela umsila kunye nokubambelela.
Okokuqala, ngokokuqulunqwa kwe-solder paste classification
I-1, i-lead solder paste: iqulethe izinto ezikhokelayo, umonakalo omkhulu kwindalo kunye nomzimba womntu, kodwa umphumo we-welding ulungile, kwaye ixabiso liphantsi, lingasetyenziswa kwezinye iimveliso ze-elektroniki ngaphandle kweemfuno zokusingqongileyo.
I-2, i-lead-free solder paste: izithako ezihambelana nokusingqongileyo, umonakalo omncinci, osetyenziswa kwimveliso ye-elektroniki ehambelana nokusingqongileyo, kunye nokuphuculwa kweemfuno zelizwe jikelele, iteknoloji engakhokhelwayo kwi-smt processing industry iya kuba ngumkhwa.
Okwesibini, ngokwendawo yokunyibilika ye-solder paste classification
Ngokuqhelekileyo, indawo yokunyibilika ye-solder paste inokwahlulwa ibe ngubushushu obuphezulu, ubushushu obuphakathi kunye nobushushu obuphantsi.
Ubushushu obuqhelekileyo obusetyenziswayo nguSn-Ag-Cu 305,0307; I-Sn-Bi-Ag yafunyanwa kubushushu obuphakathi. I-Sn-Bi isetyenziswa ngokuqhelekileyo kumaqondo aphantsi. Kwi-SMT patch processing kufuneka ikhethwe ngokweempawu ezahlukeneyo zemveliso.
Isithathu, ngokucoleka kokwahlulwa komgubo wetin
Ngokwe-particle diameter ye-tin powder, i-tin paste inokwahlulwa ibe yi-1, 2, 3, 4, 5, 6 amabakala omgubo, apho i-3, 4, 5 i-powder isetyenziswa kakhulu. Imveliso eyinkimbinkimbi ngakumbi, ukhetho lwe-tin powder kufuneka lube luncinci, kodwa i-tin powder encinci, indawo ehambelana ne-oxidation ye-tin powder iya kwanda, kwaye i-powder tin ejikelezayo inceda ukuphucula umgangatho wokushicilela.
No. 3 powder: Ixabiso lincinci, lisetyenziswa ngokuqhelekileyo kwiinkqubo ezinkulu ze-smt;
No. 4 powder: isetyenziswa ngokuqhelekileyo kwi-tight foot IC, i-smt chip processing;
No. 5 umgubo: Ihlala isetyenziswa kwizinto zokuwelda ezichanekileyo, iiselfowuni, iitafile kunye nezinye iimveliso ezifunwayo; Ubunzima bemveliso ye-smt patch processing, kubaluleke kakhulu ukhetho lwe-solder paste, kunye nokukhethwa kwe-solder paste efanelekileyo kwimveliso kunceda ukuphucula inkqubo ye-smt patch processing.
Ixesha lokuposa: Jul-05-2023
