1. I-SMT Patch Processing Factory iqulunqa iinjongo ezisemgangathweni
I-patch ye-SMT ifuna ibhodi yesekethe eprintiweyo ngokuprinta i-welded intlama kunye ne-sticker components, kwaye ekugqibeleni ireyithi yesiqinisekiso sebhodi yendibano yomhlaba ngaphandle kwesithando somlilo sifikelela okanye sisondele kwi-100%. Usuku lwe-Zero-defective re-welding, kwaye lufuna zonke ii-solder joints ukuphumeza amandla athile omatshini.
Iimveliso ezinjalo kuphela zinokufikelela umgangatho ophezulu kunye nokuthembeka okuphezulu.
Injongo yomgangatho iyalinganiswa. Okwangoku, eyona nto ingcono kakhulu enikezelwa ngamazwe ngamazwe, izinga lesiphene le-SMT linokulawulwa libe ngaphantsi kwe-10ppm (okt 10×106), njongo leyo elandelwa yiplanti ye-SMT nganye.
Ngokubanzi, iinjongo zamva nje, iinjongo zexesha eliphakathi, kunye neenjongo zexesha elide zinokuqulunqwa ngokobunzima bokulungiswa kweemveliso, iimeko zezixhobo kunye namanqanaba enkqubo yenkampani.
2. Indlela yenkqubo
① Lungiselela amaxwebhu asemgangathweni weshishini, kubandakanywa iinkcukacha zeshishini leDFM, itekhnoloji ngokubanzi, imigangatho yokuhlola, uphononongo kunye neenkqubo zokuphonononga.
② Ngolawulo olucwangcisiweyo kunye nokubeka iliso rhoqo kunye nokulawula, umgangatho ophezulu weemveliso ze-SMT uphunyeziwe, kwaye amandla okuvelisa i-SMT kunye nokusebenza kakuhle kuyaphuculwa.
③ Ukuphumeza yonke inkqubo yolawulo. Uyilo lweMveliso ye-SMT enye yoLawulo lokuThenga Inkqubo enye yeMveliso enye yoHlolo loMgangatho omnye woLawulo lweFayile yeDrip
Ukukhuselwa kwemveliso enye inkonzo ibonelela ngohlalutyo lwedatha yoqeqesho lwabasebenzi olunye.
Uyilo lwemveliso ye-SMT kunye nolawulo lokuthengwa kwempahla ayizi kwaziswa namhlanje.
Umxholo wenkqubo yokuvelisa waziswa ngezantsi.
3. Ulawulo lwenkqubo yemveliso
Inkqubo yokuvelisa ichaphazela ngokuthe ngqo umgangatho wemveliso, ngoko kufuneka ilawulwe yizo zonke izinto ezifana neeparamitha zenkqubo, abasebenzi, ukubeka nganye, izinto, エ, iindlela zokubeka iliso kunye nokuvavanya, kunye nomgangatho wokusingqongileyo, ukuze kube phantsi kolawulo.
Imiqathango yolawulo yile ilandelayo:
① Yila umzobo weskimu, indibano, iisampulu, iimfuno zokupakisha, njl.
② Ukuqulunqa amaxwebhu enkqubo yemveliso okanye iincwadi zesikhokelo sokusebenza, ezifana namakhadi enkqubo, iinkcukacha zokusebenza, iincwadi zokuhlola kunye nesikhokelo sovavanyo.
③ Izixhobo zemveliso, amatye okusebenzela, ikhadi, ukungunda, i-axis, njl.njl. zihlala zifanelekile kwaye zisebenza.
④ Qwalasela kwaye usebenzise ucupho olufanelekileyo kunye nezixhobo zokulinganisa ukulawula ezi mpawu ngaphakathi kobubanzi obuchaziweyo okanye obuvunyelweyo.
⑤ Kukho indawo ecacileyo yokulawula umgangatho. Iinkqubo eziphambili ze-SMT kushicilelo lwe-welding paste, i-patch, i-welding kwakhona kunye nolawulo lwe-welding ye-welding
Iimfuno zamanqaku okulawula umgangatho (amanqaku okulawula umgangatho) zezi: amanqaku okulawula umgangatho welogo kwindawo, iifayile zendawo yokulawula umgangatho, idatha yokulawula.
Ingxelo ichanekile, ifike ngexesha, kwaye iyamcoca, hlalutya idatha yolawulo, kwaye uvavanye rhoqo iPDCA kunye nokuvavanywa okunokwenzeka.
Kwimveliso ye-SMT, ulawulo olusisigxina luya kulawulwa kwi-welding, i-patch glue, kunye nelahleko yecandelo njengenye yomxholo wokulawula umxholo wenkqubo yaseGuanjian.
Ityala
Ulawulo loLawulo loMgangatho kunye noLawulo lweFactory ye-Electronics
1. Ukungenisa kunye nokulawula iimodeli ezintsha
1. Lungiselela ukubizwa kwangaphambili kwemveliso yeentlanganiso zangaphambi kwemveliso ezifana nesebe lemveliso, isebe lomgangatho, inkqubo kunye namanye amasebe anxulumeneyo, ingakumbi icacisa inkqubo yokuvelisa uhlobo loomatshini bokuvelisa kunye nomgangatho womgangatho wesikhululo ngasinye;
2. Ngexesha lenkqubo yenkqubo yokuvelisa okanye abasebenzi bobunjineli balungiselela inkqubo yovavanyo lovavanyo lomgca, amasebe kufuneka abe noxanduva lweenjineli (iinkqubo) ukulandelela ukulandelela ukujongana nokungahambi kakuhle kwinkqubo yovavanyo kunye nerekhodi;
3. I-Ofisi yoMgangatho kufuneka yenze uhlobo lwamacandelo aphathwayo kunye neemvavanyo ezahlukeneyo zokusebenza kunye nokusebenza kuhlobo lomatshini wokuvavanya, kwaye ugcwalise ingxelo yesilingo esihambelanayo.
2. Ulawulo lwe-ESD
1. Iimfuno zendawo yokucubungula: indawo yokugcina impahla, iinxalenye, kunye neeworkshops ze-post-welding zihlangabezana neemfuno zolawulo lwe-ESD, ukubeka izinto ezichasene ne-static emhlabeni, iqonga lokucubungula libekwe, kunye ne-impedance surface yi-104-1011Ω, kunye ne-electrostatic grounding buckle. (1MΩ ± 10%) idityanisiwe;
2. Iimfuno zabasebenzi: Ukunxiba iimpahla ezingashukumiyo, izihlangu, kunye neminqwazi kufuneka zinxitywe kwindawo yokusebenzela. Xa uqhagamshelana nemveliso, kufuneka unxibe intambo ye-static ring;
3. Sebenzisa iingxowa ezinogwebu kunye neebhalu zomoya kwiishelufu zerotor, ukupakishwa, kunye namaqamza omoya, ekufuneka ahlangabezane neemfuno ze-ESD. Ukuphazamiseka komphezulu <1010Ω;
4. Isakhelo se-turntable sifuna ikhonkco yangaphandle ukufezekisa isiseko;
5. Isixhobo sokuvuza kwamandla ngu <0.5V, i-impedance yomhlaba ngu <6Ω, kunye ne-soldering iron impedance <20Ω. Isixhobo kufuneka sivavanye umgca womhlaba ozimeleyo.
3. Ulawulo lwe-MSD
1. BGA.IC. I-tube iinyawo zokupakisha imathiriyeli kulula ukubandezeleka phantsi kweemeko zokupakisha ezingenayo i-vacuum (nitrogen). Xa i-SMT ibuya, amanzi ayafudunyezwa kwaye aguquke. Ukuwelda akuqhelekanga.
2. Inkcazo yolawulo lwe-BGA
(1) I-BGA, engakhupheli isingxobo se-vacuum, kufuneka igcinwe kwindawo enobushushu obungaphantsi kwama-30 ° C kunye nokufuma okungaphantsi kwama-70%. Ixesha lokusetyenziswa ngunyaka omnye;
(2) I-BGA ethe yakhululwa kwipakethe ye-vacuum kufuneka ibonise ixesha lokutywinwa. I-BGA engaqaliswanga igcinwe kwikhabhathi yobungqina bokufuma.
(3) Ukuba i-BGA eye yavulwa ayifumaneki ukuba isetyenziswe okanye ibhalansi, kufuneka igcinwe kwibhokisi yobungqina bokufuma (imeko ≤25 ° C, 65% RH) Ukuba i-BGA yesitora esikhulu sibhakwa ngu. i-warehouse enkulu, i-warehouse enkulu itshintshiwe ukuyitshintsha ukuyisebenzisa ukuyitshintsha ukuze isebenzise Ukugcinwa kweendlela zokupakisha i-vacuum;
(4) Abo badlula ixesha lokugcinwa kufuneka babhakwe kwi-125 ° C/24HRS. Abo bangakwaziyo ukuzibhaka kwi-125 ° C, emva koko babhake kwi-80 ° C/48HRS (ukuba zibhakwe ngokuphindaphindiweyo 96HRS) zingasetyenziswa kwi-intanethi;
(5) Ukuba iinxalenye zineenkcazo ezikhethekileyo zokubhaka, ziya kufakwa kwi-SOP.
3. Umjikelo we-PCB wokugcina> iinyanga ezi-3, i-120 ° C 2H-4H isetyenziswa.
Okwesine, iinkcukacha zolawulo lwePCB
1. PCB ukutywinwa kunye nokugcinwa
(1) Ibhodi yePCB eyimfihlo yokutywina umhla wokwenziwa kokukhutshwa kwempahla ingasetyenziswa ngokuthe ngqo kwiinyanga ezi-2;
(2) Umhla wokwenziwa kwebhodi yePCB ungaphakathi kweenyanga ezi-2, kwaye umhla wokudilizwa kufuneka uphawulwe emva kokutywinwa;
(3) Umhla wokwenziwa kwebhodi yePCB ungaphakathi kweenyanga ezi-2, kwaye kufuneka isetyenziswe ekusetyenzisweni kwiintsuku ezi-5 emva kokudilizwa.
2. PCB yokubhaka
(1) Abo batywina i-PCB kwiinyanga ezi-2 zomhla wokuvelisa ngaphezu kweentsuku ezi-5, nceda ubhake kwi-120 ± 5 ° C ngeyure eli-1;
(2) Ukuba i-PCB idlula iinyanga ezi-2 ngaphezu komhla wokwenziwa, nceda ubhake kwi-120 ± 5 ° C ngeyure eli-1 ngaphambi kokuqaliswa;
(3) Ukuba i-PCB idlula iinyanga ezi-2 ukuya kwezi-6 zomhla wokwenziwa, nceda ubhake kwi-120 ± 5 ° C kwiiyure ze-2 ngaphambi kokungena kwi-intanethi;
(4) Ukuba i-PCB idlula kwiinyanga ezi-6 ukuya kunyaka o-1, nceda ubhake kwi-120 ± 5 ° C kwiiyure ze-4 ngaphambi kokuqaliswa;
(5) I-PCB ebhakiweyo kufuneka isetyenziswe kwiintsuku ezi-5, kwaye kuthatha iyure e-1 ukubhaka iyure enye ngaphambi kokuba isetyenziswe.
(6) Ukuba iPCB igqithile kumhla wokwenziwa komnyaka omnye, nceda ubhake kwi-120 ± 5 ° C iiyure ezi-4 phambi kokuqaliswa, uze uthumele umzi-mveliso we-PCB ukuba uphinde utshize i-tin ukuze ube kwi-intanethi.
3. Ixesha lokugcinwa kwe-IC vacuum seal package:
1. Nceda uqaphele umhla wokutywinwa kwebhokisi nganye yokupakishwa kwevacuum;
2. Ixesha lokugcinwa: iinyanga ezili-12, iimeko zendawo yokugcina indawo: kwiqondo lokushisa
3. Khangela ikhadi lokufuma: ixabiso lokubonisa kufuneka libe ngaphantsi kwe-20% (bhlowu), njenge> 30% (bomvu), ebonisa ukuba i-IC ifunxe ukufuma;
4. Icandelo le-IC emva kokutywinwa lingasetyenziswanga kwiiyure ezingama-48: ukuba alisetyenziswanga, icandelo le-IC kufuneka libhakwe kwakhona xa kuqaliswa ukuqaliswa kwesibini ukususa ingxaki ye-hygroscopic yecandelo le-IC:
(1) Izinto zokupakisha zobushushu obuphezulu, 125 ° C (± 5 ° C), iiyure ezingama-24;
(2) Musa ukuxhathisa izinto zokupakisha ukushisa okuphezulu, i-40 ° C (± 3 ° C), iiyure ze-192;
Ukuba awuyisebenzisi, kufuneka uyibuyisele kwibhokisi eyomileyo ukuze uyigcine.
5. Ulawulo lwengxelo
1. Kwinkqubo, uvavanyo, ukugcinwa, ukunika ingxelo, umxholo wengxelo, kunye nokuqulethwe yingxelo kubandakanya (inombolo ye-serial, iingxaki ezingathandekiyo, amaxesha exesha, ubungakanani, ireyithi engalunganga, ucazululo lwesizathu, njl.njl.)
2. Ngethuba lenkqubo yokuvelisa (uvavanyo), isebe lomgangatho kufuneka lifumane izizathu zokuphucula kunye nokuhlalutya xa imveliso iphezulu njenge-3%.
3. Ngokuhambelanayo, inkampani kufuneka iqhube iinkcukacha-manani, uvavanyo, kunye neengxelo zogcino ukuze isombulule ifomu yengxelo yenyanga ukuze ithumele ingxelo yenyanga kumgangatho nenkqubo yenkampani yethu.
Ezintandathu, incama incama ukuprinta kunye nolawulo
1. Ishumi lokunamathisela kufuneka ligcinwe kwi-2-10 ° C. Isetyenziswe ngokuhambelana nemigaqo ye-preliminary yokuqala, kunye nokulawulwa kwethegi kusetyenziswa. I-tinnigo paste ayisuswanga kwiqondo lokushisa, kwaye ixesha lokufaka idiphozithi yesikhashana akufanele lidlule iiyure ezingama-48. Yibuyisele efrijini ngexesha lefriji. Intlama kaKaifeng kufuneka isetyenziswe kwi-24 encinci. Ukuba ayisetyenziswanga, nceda uyibuyisele efrijini kwangethuba ukuze uyigcine kwaye wenze irekhodi.
2. Umatshini wokuprinta wokuprinta we-tin ngokuzenzekelayo ufuna ukuqokelela intlama ye-tin kumacala omabini e-spatula rhoqo ngemizuzu engama-20, kwaye ungeze intlama entsha ye-tin rhoqo nge-2-4h;
3. Inxalenye yokuqala yetywina yesilika yemveliso ithatha amanqaku ali-9 ukulinganisa ubukhulu bentlama yenkcenkce, ubukhulu bobunzima be-tin: umda ongaphezulu, ubukhulu bomnatha wentsimbi+ubukhulu bomnatha wentsimbi*40%, umda osezantsi, ubukhulu bomnatha wentsimbi+ubukhulu bomnatha wentsimbi*20%. Ukuba ukusetyenziswa kwesixhobo sonyango sokushicilela kusetyenziselwa i-PCB kunye ne-curetic ehambelanayo , kulungele ukuqinisekisa ukuba unyango lubangelwa ukwanela okwaneleyo; imbuyekezo ye-welding test data yeqondo lokushisa eziko ibuyiswa, kwaye iqinisekisiwe ubuncinane kanye ngosuku. I-Tinhou isebenzisa ulawulo lwe-SPI kwaye ifuna umlinganiselo rhoqo nge-2H. Ingxelo yokuhlolwa kwembonakalo emva kwesithando somlilo, ihanjiswe kanye rhoqo nge-2 h, kwaye idlulisele idatha yokulinganisa kwinkqubo yethu yenkampani;
4. Ukuprintwa kakubi kwe-tin paste, sebenzisa ilaphu elingenathuli, coca i-PCB surface tin paste, kwaye usebenzise umpu womoya ukucoca umphezulu ukuze ushiye umgubo we-tin;
5. Ngaphambi kwenxalenye, ukuzihlola ngokwakho kwe-tin paste i-biased kunye ne-tin tip. Ukuba iprintiweyo iprintwe, kuyimfuneko ukuhlalutya unobangela ongaqhelekanga ngexesha.
6. Ulawulo lwamehlo
1. Ukuqinisekiswa kwezinto: Khangela i-BGA ngaphambi kokuqaliswa, ukuba i-IC ipakisha i-vacuum. Ukuba ayivulwanga kwipakethe ye-vacuum, nceda ujonge ikhadi lesalathisi sokufuma kwaye ukhangele ukuba kukufuma.
(1) Nceda ujonge indawo xa izinto zisezintweni, khangela izinto ezingalunganga kakhulu, kwaye ubhalise kakuhle;
(2) Ukubeka iimfuno zeprogram: Nika ingqalelo ukuchaneka kwesiqwenga;
(3) Ingaba uvavanyo lokuzivavanya lucalanye emva kwenxalenye; ukuba kukho i-touchpad, kufuneka iqalwe kwakhona;
(4) Ngokuhambelana ne-SMT SMT IPQC rhoqo kwiiyure ze-2, kufuneka uthathe iziqwenga ze-5-10 kwi-DIP ngaphezulu-welding, wenze uvavanyo lwe-ICT (FCT) umsebenzi. Emva kokuvavanya Kulungile, kufuneka uyiphawule kwi-PCBA.
Isixhenxe, ulawulo lwembuyekezo kunye nolawulo
1. Xa i-welding i-overwing, setha ukushisa kwesithando somlilo ngokusekelwe kwinqanaba eliphezulu le-elektroniki, kwaye ukhethe ibhodi yokulinganisa ubushushu bemveliso ehambelanayo ukuvavanya ukushisa kwesithando somlilo. Ijika lobushushu besithando somlilo esingeniswa kumazwe angaphandle lisetyenziselwa ukuhlangabezana nokuba iimfuno ze-welding ze-lead-free tin paste ziyafezekiswa;
2. Sebenzisa iqondo lobushushu eziko, ulawulo lwecandelo ngalinye ngolu hlobo lulandelayo, ithambeka lokufudumeza kunye nethambeka lokupholisa kwiqondo lobushushu elingaguqukiyo lobushushu bexesha lokunyibilika (217 ° C) ngaphezu kwe-220 okanye ngaphezulu kwexesha le-1 ℃ ～ 3 ℃ /SEC -1 ℃ ～ -4 ℃/SEC 150℃ 60 ~ 120SEC 30 ～ 60SEC 30 ～ 60SEC;
3. Ixesha lemveliso lingaphezulu kwe-10cm ukuphepha ukufudumeza okungalinganiyo, isikhokelo kude kube yi-welding ebonakalayo;
4. Musa ukusebenzisa ikhadibhodi ukubeka iPCB ukunqanda ukungqubana. Sebenzisa ukudluliselwa kweveki okanye i-anti-static foam.
8. Inkangeleko ye-Optical kunye noviwo lwembono
1. BGA ithatha iiyure ezimbini ukuthatha X-reyi kanye ngalo lonke ixesha, khangela umgangatho welding, kwaye khangela ukuba amanye amacandelo biased, Shaoxin, amaqamza kunye nezinye ukuwelda kakubi. Ukuvela ngokuqhubekayo kwi-2PCS ukwazisa uhlengahlengiso lwamagcisa;
I-2.BOT, i-TOP kufuneka ihlolwe umgangatho wokufumanisa i-AOI;
3. Khangela iimveliso ezimbi, sebenzisa iilebhile ezimbi ukuphawula iindawo ezimbi, kwaye uzibeke kwiimveliso ezimbi. Ubume bendawo bahlulwe ngokucacileyo;
4. Iimfuno zesivuno samalungu e-SMT zingaphezulu kwe-98%. Kukho iinkcukacha-manani zengxelo ezidlula umgangatho kunye nesidingo sokuvula uhlalutyo olulodwa olungaqhelekanga kunye nokuphucula, kwaye iyaqhubeka nokuphucula ukulungiswa kokungabikho kokuphucula.
Isithoba, ukuwelda ngasemva
1. I-lead-free-free tin iqondo lokushisa lilawulwa kwi-255-265 ° C, kwaye ixabiso elincinci le-solder joint lobushushu kwibhodi ye-PCB yi-235 ° C.
2. Iimfuno zoseto ezisisiseko zokuwelda amaza:
a. Ixesha lokucwina i-tin kukuba: I-Peak 1 ilawula kwi-0.3 ukuya kwi-1 yesibini, kwaye i-peak 2 ilawula i-2 ukuya kwi-3 imizuzwana;
b. Isantya sothumelo yile: 0.8 ～ 1.5 yeemitha / ngomzuzu;
c. Thumela i-angle inclination 4-6 degrees;
d. Uxinzelelo lwe-spray ye-agent edibeneyo yi-2-3PSI;
e. Uxinzelelo lwevalve yenaliti yi-2-4PSI.
3. I-plug-in imathiriyeli ingaphezulu kwe-welding-peak. Imveliso kufuneka yenziwe kwaye isetyenziswe i-foam ukwahlula ibhodi ebhodini ukuphepha ukungqubana kunye nokuxubha iintyatyambo.
Ishumi, uvavanyo
1. Uvavanyo lwe-ICT, ukuvavanya ukuhlukana kweemveliso ze-NG kunye ne-OK, iibhodi zovavanyo ze-OK kufuneka zifakwe nge-ICT test label kwaye zihluke kwi-foam;
2. Uvavanyo lwe-FCT, uvavanyo lokuhlukana kweemveliso ze-NG kunye ne-OK, uvavanyo lwebhodi ye-OK kufuneka ifakwe kwileyibhile yovavanyo ye-FCT kwaye ihluke kwi-foam. Iingxelo zovavanyo kufuneka zenziwe. Inombolo yothotho kwingxelo kufuneka ihambelane nenombolo yothotho kwibhodi yePCB. Nceda uyithumele kwimveliso ye-NG kwaye wenze umsebenzi olungileyo.
Ishumi elinanye, ukupakishwa
1. Inkqubo yokusebenza, sebenzisa ukudluliselwa kweveki okanye i-foam e-anti-static thick, i-PCBA ayikwazi ukupakishwa, ukuphepha ukungqubana, kunye noxinzelelo oluphezulu;
2. Ngaphezulu kokuthunyelwa kwe-PCBA, sebenzisa i-anti-static bubble bag packaging (ubungakanani bengxowa ye-static bubble kufuneka ihambelane), kwaye emva koko ihlanganiswe nge-foam ukukhusela imikhosi yangaphandle ekunciphiseni i-buffer. Ukupakishwa, ukuthunyelwa ngeebhokisi zeerubha ze-static, ukongeza izahlulo phakathi kwemveliso;
3. Iibhokisi zerabha zifakwe kwi-PCBA, ngaphakathi kwebhokisi yerabha ihlambulukile, ibhokisi yangaphandle ibhalwe ngokucacileyo, kubandakanywa nomxholo: umenzi wokucubungula, inombolo yomyalelo womyalelo, igama lemveliso, ubuninzi, umhla wokuhanjiswa.
12. Ukuthumela ngenqanawa
1. Xa kuthunyelwa, ingxelo yovavanyo lwe-FCT kufuneka iqhotyoshelwe, ingxelo yokugcinwa kwemveliso embi, kunye nengxelo yokuhlola ukuthunyelwa iyimfuneko.
Ixesha lokuposa: Jun-13-2023
