Xa sixoxa nge-solder beading, kufuneka siqale sichaze ngokuchanekileyo isiphene se-SMT. I-tin bead ifumaneka kwipleyiti edityanisiweyo ye-reflow, kwaye unokutsho ngokujonga nje ukuba yibhola enkulu yetoti emiliselwe echibini lokuqukuqela elibekwe kufutshane nezinto ezidityanisiweyo ezinobude obuphantsi kakhulu bomhlaba, njengezichasi zeshiti kunye neecapacitors, ezibhityileyo. iipakethe ezincinci zeprofayili (TSOP), i-transistors encinci yeprofayili (SOT), i-D-PAK transistors, kunye neendibano zokumelana. Ngenxa yokuma kwawo ngokunxulumene nala macandelo, amaso etoti adla ngokubizwa ngokuba “ziisathelayithi”.
Amaso e-tin awachaphazeli nje ukubonakala kwemveliso, kodwa okona kubaluleke kakhulu, ngenxa yobuninzi bamacandelo kwi-plate eprintiweyo, kukho ingozi yesiphaluka esifutshane somgca ngexesha lokusetyenziswa, ngaloo ndlela ichaphazela umgangatho weemveliso ze-elektroniki. Kukho izizathu ezininzi zokuvelisa amaso e-tin, ahlala ebangelwa yinto enye okanye ngaphezulu, ngoko kufuneka senze umsebenzi omhle wokuthintela kunye nokuphucula ukwenzela ukulawula kakuhle. Inqaku elilandelayo liza kuxubusha oothunywashe abachaphazela ukuveliswa kwamaso enkcenkce namanyathelo okuthintela ukuveliswa kwamaso enkcenkce.
Kutheni kwenzeka amaso e-tin?
Ngamafutshane, amaso e-tin adla ngokunxulunyaniswa ne-solder paste deposition kakhulu, ngenxa yokuba ayinayo "umzimba" kwaye icinezelwe phantsi kweenxalenye ezicacileyo ukwenza amaso e-tin, kwaye ukwanda kwenkangeleko yabo kunokubangelwa kukwanda kokusetyenziswa kokuhlanjululwa. -kwintlama yesolder. Xa i-chip element ifakwe kwintlama ye-solder ehlanjululwayo, i-solder paste inokwenzeka ukuba icudise phantsi kwecandelo. Xa i-solder efakwe kwi-paste ininzi kakhulu, kulula ukuyikhupha.
Izinto eziphambili ezichaphazela ukwenziwa kwamaso enkcenkce zezi:
(1) Ukuvula itemplate kunye noyilo lwegraphic pad
(2) Ukucoca itemplate
(3) Ukuphindaphinda ukuchaneka komatshini
(4) Iqondo lobushushu legophe le-reflow furnace
(5) Uxinzelelo lwepetshi
(6) i-solder intlama ubuninzi ngaphandle kwepani
(7) Umphakamo wokumisa wetoti
(8) Ukukhutshwa kwegesi kwezinto eziguquguqukayo kwi-line plate kunye ne-solder resistance layer
(9)Inxulumene nokuguquguquka
Iindlela zokuthintela ukuveliswa kwamaso e-tin:
(1) Khetha imizobo yephedi efanelekileyo kunye noyilo lobungakanani. Kuyilo lokwenyani iphedi, kufuneka zidityaniswe nePC, kwaye ngoko ngokweyona nxalenye yobungakanani bephakheji yecandelo, ubungakanani besiphelo se-welding, ukuyila ubungakanani bepadi ehambelanayo.
(2) Nika ingqalelo kwimveliso yentsimbi yentsimbi. Kuyimfuneko ukunyenyisa ubungakanani bokuvula ngokwecandelo elithile lobeko lwebhodi yePCBA ukulawula inani loshicilelo lokuncamathisela kwe-solder.
(3) Kucetyiswa ukuba iibhodi PCB engenanto kunye BGA, QFN kunye amacandelo unyawo ashinyeneyo ebhodini ukuthatha inyathelo lokubhaka engqongqo. Ukuqinisekisa ukuba ukufuma komhlaba kwipleyiti ye-solder kuyasuswa ukuze kwandiswe ukuweldability.
(4) Ukuphucula umgangatho wokucoca itemplate. Ukuba ukucoca akucocekanga. Intsalela ye-solder paste emazantsi okuvulwa kwetemplate iya kuqokelela kufutshane nokuvulwa kwetemplate kwaye yenze intlama yesolder eninzi, ibangele amaso e-tin.
(5) Ukuqinisekisa ukuphindaphinda kwezixhobo. Xa i-solder paste ishicilelwe, ngenxa ye-offset phakathi kwe-template kunye ne-pad, ukuba i-offset ikhulu kakhulu, i-solder paste iya kuxutywa ngaphandle kwe-pad, kwaye amaso e-tin aya kubonakala ngokulula emva kokufudumeza.
(6) Lawula uxinzelelo olunyukayo lomatshini wokunyuka. Nokuba imowudi yolawulo loxinzelelo incamathele, okanye ulawulo lobuninzi becandelo, iiSetingi kufuneka zihlengahlengiswe ukuthintela amaso etoti.
(7)Yengeza ijiko lobushushu. Lawula ubushushu be-welding ye-reflow, ukwenzela ukuba i-solvent ikwazi ukuguquguquka kwiqonga elingcono.
Musa ukukhangela "isathelayithi" incinci, umntu akanakutsalwa, atsale umzimba wonke. Ngombane, umtyholi uhlala kwiinkcukacha. Ke ngoko, ukongeza kwingqwalasela yabasebenzi benkqubo yokuvelisa, amasebe afanelekileyo kufuneka asebenzisane ngenkuthalo, kwaye anxibelelane nabasebenzi benkqubo ngexesha lokutshintsha kwezinto, ukutshintshwa kunye neminye imiba yokuthintela utshintsho kwiiparamitha zenkqubo ezibangelwa kukutshintsha kwezinto. Umyili onoxanduva loyilo lwesekethe ye-PCB kufuneka kwakhona anxibelelane nabasebenzi benkqubo, abhekisele kwiingxaki okanye kwiingcebiso ezinikwe ngabasebenzi benkqubo kwaye aziphucule kangangoko kunokwenzeka.
Ixesha lokuposa: Jan-09-2024
