Qonda i-DIP
I-DIP yi-plug-in. Iichips ezipakishwe ngolu hlobo zinemiqolo emibini yezikhonkwane, ezinokudityaniswa ngokuthe ngqo kwiisokethi ze-chip kunye nesakhiwo se-DIP okanye i-welded kwi-welding positions ezinenani elifanayo lemingxuma. Kuyinto elula kakhulu ukuba uqaphele PCB ibhodi perforation welding, kwaye iyahambelana kakuhle motherboard, kodwa ngenxa yendawo yokupakisha yayo kunye nobukhulu zinkulu ngokwentelekiso, kwaye isikhonkwane kwinkqubo yokufakwa kunye nokususwa kulula ukuba yonakaliswe, ukuthembeka kakubi.
I-DIP iyona iphakheji ethandwa kakhulu kwi-plug-in, uluhlu lwesicelo lubandakanya i-logic eqhelekileyo ye-IC, imemori ye-LSI, iisekethe ze-microcomputer, njl njl. iphakheji yeprofayili), i-VSOP (iphakheji yeprofayili encinci kakhulu), i-SSO (i-SOP encitshisiweyo), i-TSSOP (i-SOP encinci encinci) kunye ne-SOT (i-transistor encinci yeprofayili), i-SOIC (iprofayili encinci edibeneyo yesiphaluka), njl.
Isiphene soyilo lwendibano yesixhobo se-DIP
Umngxuma wepakethe yePCB mkhulu kunesixhobo
PCB plug-in imingxunya kunye nemingxuma pin yepakethe zizotywa ngokuhambelana neenkcukacha. Ngenxa yesidingo sokutyalwa kobhedu emingxunyeni ngexesha lokwenziwa kwepleyiti, ukunyamezelana ngokubanzi kudityaniswe okanye kuthatyathwe 0.075mm. Ukuba umngxuma wokupakisha we-PCB mkhulu kakhulu kune-pin yesixhobo somzimba, oko kuya kukhokelela ekukhululweni kwesixhobo, i-tin eyaneleyo, i-welding yomoya kunye nezinye iingxaki ezisemgangathweni.
Jonga umfanekiso ongezantsi, usebenzisa i-WJ124-3.81-4P_WJ124-3.81-4P (KANGNEX) iphini yesixhobo yi-1.3mm, umngxuma wokupakisha we-PCB yi-1.6mm, i-aperture inkulu kakhulu kwi-welding ye-welding space time welding.
Iqhotyoshelwe kumzobo, thenga i-WJ124-3.81-4P_WJ124-3.81-4P (KANGNEX) amacandelo ngokweemfuno zoyilo, i-pin 1.3mm ichanekile.
Umngxuma wepakethe yePCB incinci kunesixhobo
I-Plug-in, kodwa ayiyi kubhobhoza akukho bhedu, ukuba i-single kunye neepaneli ezimbini zingasebenzisa le ndlela, iipaneli ezingatshatanga kunye nezimbini ziyi-conductor yangaphandle yombane, i-solder ingaba i-conductive; I-plug-in hole yebhodi ye-multilayer incinci, kwaye ibhodi ye-PCB inokulungiswa kuphela ukuba umaleko wangaphakathi unomqhubi wombane, ngenxa yokuba i-conduction yangaphakathi yangaphakathi ayinakulungiswa ngokuphinda kubuyiselwe.
Njengoko kubonisiwe kumzobo ongezantsi, amacandelo e-A2541Hwv-3P_A2541HWV-3P (CJT) athengwa ngokweemfuno zoyilo. I-pin yi-1.0mm, kunye ne-PCB yokutywina i-pad hole yi-0.7mm, okubangela ukusilela ukufaka.
Amacandelo e-A2541Hwv-3P_A2541HWV-3P (CJT) athengwa ngokweemfuno zoyilo. Iphini 1.0mm ichanekile.
Izithuba zepakethe zephini ziyohluka kwisithuba sesixhobo
I-PCB yokutywina iphedi yesixhobo se-DIP ayinayo kuphela indawo yokuvula efana ne-pin, kodwa ifuna umgama ofanayo phakathi kwemingxuma ye-pin. Ukuba isithuba phakathi kwemingxuma yezikhonkwane kunye nesixhobo asihambisani, isixhobo asinakufakwa, ngaphandle kwamalungu anesithuba esilungelelanisiweyo sonyawo.
Njengoko kubonisiwe kulo mzobo ungezantsi, umngxuma pin umngxuma umgama PCB ukupakishwa yi 7.6mm, kwaye umngxuma pin umgama amacandelo ezithengiweyo yi 5.0mm. Umahluko we-2.6mm ukhokelela ekubeni isixhobo singasetyenziswa.
Imingxuma yokupakisha ye-PCB isondele kakhulu
Kuyilo lwePCB, umzobo kunye nokupakishwa, kuyimfuneko ukunikela ingqalelo kumgama phakathi kwemingxunya yephini. Nokuba ipleyiti engenanto inokuveliswa, umgama phakathi kwemingxunya yephini incinci, kulula ukubangela isekethe emfutshane yetin ngexesha lendibano ngokuthengiswa kwamaza.
Njengoko kubonisiwe kumzobo ongezantsi, isiphaluka esifutshane sinokubangelwa ngumgama omncinci wepini. Kukho izizathu ezininzi zesekethe emfutshane kwi-solder tin. Ukuba ukudibanisa kunokuthintelwa kwangaphambili ekupheleni koyilo, iziganeko zeengxaki zingancitshiswa.
Isixhobo se-DIP sengxaki yesikhonkwane
Inkcazo yengxaki
Emva kokuwelda i-wave crest yemveliso ye-DIP, kwafunyaniswa ukuba kukho ukunqongophala okukhulu kwetoti kwipleyiti ye-solder yonyawo olusisigxina lwesokethi yomnatha, eyayiyeye-welding yomoya.
Impembelelo yengxaki
Ngenxa yoko, ukuzinza kwesokethi yenethiwekhi kunye nebhodi ye-PCB iba mbi kakhulu, kwaye amandla onyawo lwe-pin yesignali iya kwenziwa ngexesha lokusetyenziswa kwemveliso, eya kuthi ekugqibeleni ikhokelele ekudibaneni kwe-pin ye-signal foot, echaphazela imveliso. ukusebenza kunye nokubangela umngcipheko wokungaphumeleli ekusebenziseni abasebenzisi.
Ukwandiswa kwengxaki
Uzinzo lwesokethi yenethiwekhi ihluphekile, ukusebenza koqhagamshelwano lwepini yesignali kubi, kukho iingxaki ezisemgangathweni, ngoko kunokuzisa imingcipheko yokhuseleko kumsebenzisi, ilahleko yokugqibela ayinakucingelwa.
Ukuhlolwa kohlalutyo lwendibano yesixhobo se-DIP
Kukho iingxaki ezininzi ezinxulumene nezikhonkwane zesixhobo se-DIP, kwaye amanqaku amaninzi aphambili alula ukuba angahoywa, okukhokelela kwibhodi yokugqibela ye-scrap. Ngoko njani ngokukhawuleza kwaye ngokupheleleyo ukusombulula iingxaki ezinjalo kanye?
Apha, indibano kunye nomsebenzi wohlalutyo lwesoftware yethu ye-CHIPSTOCK.TOP ingasetyenziselwa ukwenza uhlolo olukhethekileyo kwizikhonkwane zezixhobo ze-DIP. Izinto zokuhlola ziquka inani lezikhonkwane emigodini, umda omkhulu weepini ze-THT, umda omncinci we-THT izikhonkwane kunye neempawu ze-THT izikhonkwane. Izinto zokuhlolwa kwezikhonkwane zigubungela ngokusisiseko iingxaki ezinokwenzeka kuyilo lwezixhobo ze-DIP.
Emva kokugqitywa koyilo lwe-PCB, umsebenzi wokuhlalutya indibano ye-PCBA ingasetyenziselwa ukufumanisa iziphene zokuyila kwangaphambili, ukucombulula i-anomalies yoyilo phambi kwemveliso, kwaye uphephe iingxaki zoyilo kwinkqubo yokuhlanganisa, ixesha lokuvelisa ukulibaziseka kunye nenkcitho yophando kunye neendleko zophuhliso.
Umsebenzi wayo wokuhlalutya indibano unezinto ezili-10 eziphambili kunye nemithetho yokuhlolwa kwezinto ezilungileyo ze-234, ezigubungela zonke iingxaki zendibano ezinokwenzeka, njengokuhlalutya isixhobo, uhlalutyo lwepini, uhlalutyo lwe-pad, njl., ezinokucombulula iimeko ezahlukeneyo zokuvelisa iinjineli ezingenakuzilindela kwangaphambili.
Ixesha lokuposa: Jul-05-2023
