Iindlela zokubona eziqhelekileyo zebhodi yePCB zezi zilandelayo:
1, ibhodi yePCB yokuhlola okubonwayo ngesandla
Ukusebenzisa iglasi yokukhulisa okanye i-microscope elinganisiweyo, uhlolo olubonakalayo lomsebenzisi yeyona ndlela yendabuko yokuhlola ukufumanisa ukuba ibhodi yesekethe iyalingana kwaye xa imisebenzi yolungiso ifuneka. Iinzuzo zayo eziphambili zixabiso eliphantsi eliphantsi kwaye akukho vavanyo lokuvavanya, ngelixa iziphene zayo eziphambili ziyimpazamo yomntu, iindleko eziphezulu zexesha elide, ukufumanisa isiphene esingapheliyo, ubunzima bokuqokelelwa kwedatha, njl. Ngoku, ngenxa yokwanda kwemveliso yePCB, ukunciphisa yezithuba zeengcingo kunye nomthamo wecandelo kwi-PCB, le ndlela iya isiba ingasebenzi.
2, ibhodi PCB uvavanyo online
Ngokuchongwa kweepropathi zombane ukufumanisa iziphene zokuvelisa kunye novavanyo lwe-analog, idijithali kunye nenxalenye yeempawu ezixubeneyo zokuqinisekisa ukuba ziyahlangabezana nemigaqo, kukho iindlela ezininzi zovavanyo ezifana ne-inaliti yokuhlola ibhedi kunye nomvavanyi wenaliti ephaphazelayo. Iingenelo eziphambili zixabiso eliphantsi lokuvavanya ibhodi nganye, amandla okuvavanya idijithali kunye nokusebenza, ngokukhawuleza nangokucokisekileyo uvavanyo lwesekethe olufutshane kunye oluvulekileyo, i-firmware yeprogram, i-coverage ephezulu kunye nokulula kweprogram. Iingxaki eziphambili ziyimfuneko yokuvavanya i-clamp, iprogram kunye nexesha lokulungisa, iindleko zokwenza ukulungiswa kuphezulu, kwaye ubunzima bokusetyenziswa bukhulu.
3, uvavanyo lomsebenzi webhodi yePCB
Uvavanyo lwenkqubo esebenzayo kukusebenzisa izixhobo zokuvavanya ezikhethekileyo kwinqanaba eliphakathi kunye nokuphela komgca wokuvelisa ukwenza uvavanyo olubanzi lweemodyuli ezisebenzayo zebhodi yesiphaluka ukuqinisekisa umgangatho webhodi yesiphaluka. Uvavanyo olusebenzayo lunokuthiwa ngowona mgaqo-siseko wokuvavanya ngokuzenzekelayo, osekelwe kwibhodi ethile okanye iyunithi ethile kwaye inokugqitywa ngezixhobo ezahlukeneyo. Kukho iintlobo zovavanyo lokugqibela lwemveliso, imodeli eqinileyo yamva nje, kunye novavanyo olupakishiweyo. Uvavanyo olusebenzayo ngokuqhelekileyo aluboneleli ngedatha enzulu njenge-pin kunye nenqanaba lokuxilongwa kwecandelo lokuguqulwa kwenkqubo, kwaye ifuna izixhobo ezikhethekileyo kunye neenkqubo zovavanyo eziyilwe ngokukodwa. Ukubhala iinkqubo zovavanyo ezisebenzayo zinzima kwaye ngoko ke azifanelekanga kwimigca emininzi yokuvelisa ibhodi.
4, ubhaqo oluzenzekelayo lwamehlo
Eyaziwa nangokuthi ukuhlolwa okubonakalayo okuzenzekelayo, kusekelwe kumgaqo we-optical, ukusetyenziswa ngokubanzi kohlalutyo lomfanekiso, ikhompyutha kunye nolawulo oluzenzekelayo kunye nobunye ubuchwepheshe, iziphene ezifunyenwe kwimveliso yokuchongwa kunye nokusebenza, yindlela entsha yokuqinisekisa iziphene zokuvelisa. I-AOI idla ngokusetyenziswa ngaphambi nangemva kokuhamba kwakhona, ngaphambi kokuvavanywa kombane, ukuphucula izinga lokwamkelwa ngexesha lonyango lombane okanye isigaba sokuvavanya umsebenzi, xa iindleko zokulungiswa kweziphene ziphantsi kakhulu kuneendleko emva kovavanyo lokugqibela, ngokuphindaphindiweyo ukuya kumaxesha alishumi.
5, uviwo lweX-reyi oluzenzekelayo
Ngokusebenzisa ukufunxa okwahlukileyo kwezinto ezahlukeneyo kwiX-reyi, sinokubona ngaphaya kwamalungu afuna ukubonwa kwaye afumane iziphene. Isetyenziselwa kakhulu ukufumanisa i-ultra-fine pitch kunye ne-ultra-high density circuit boards kunye neziphene ezifana nebhulorho, i-chip elahlekileyo kunye nokulungelelaniswa okungahambi kakuhle okwenziwe kwinkqubo yokuhlanganisa, kwaye inokubona iziphene zangaphakathi ze-IC chips usebenzisa iteknoloji ye-imaging ye-tomographic. Ngoku kuphela kwendlela yokuvavanya umgangatho we-welding ye-ball grid array kunye neebhola ze-tin ezikhuselekileyo. Iinzuzo eziphambili kukukwazi ukubona umgangatho we-welding ye-BGA kunye namacandelo afakwe ngaphakathi, akukho ndleko yokulungisa; Ezona zinto zingahambi kakuhle zisantya esicothayo, izinga eliphezulu lokungaphumeleli, ubunzima ekubhaqeni amajoyinti e-solder asetyenzisiweyo, ixabiso eliphezulu, kunye nexesha elide lophuhliso lwenkqubo, eyindlela entsha yokufumanisa kwaye kufuneka ifundwe ngakumbi.
I-6, inkqubo yokufumanisa i-laser
Luphuhliso lwamva nje lweteknoloji yovavanyo lwe-PCB. Isebenzisa i-laser beam ukuskena ibhodi eprintiweyo, ukuqokelela yonke idatha yokulinganisa, kwaye uthelekise ixabiso langempela lokulinganisa kunye nexabiso elimiselweyo elilinganiselweyo elilinganiselweyo. Le teknoloji ibonakaliswe kwiipleyiti ezikhanyayo, ithathelwa ingqalelo yokuvavanya ipleyiti yendibano, kwaye ikhawuleza ngokwaneleyo kwimigca yemveliso yobuninzi. Ukuphuma ngokukhawuleza, akukho mfuneko yokulungiswa kunye nokufikelela okubonakalayo okungenamaski zizinto zayo eziphambili; Iindleko eziphezulu zokuqala, ukugcinwa kunye neengxaki zokusetyenziswa zizona ntsilelo zayo eziphambili.
7, ukubonwa kobungakanani
Imilinganiselo yendawo yomngxuma, ubude nobubanzi, kunye neqondo lendawo ilinganiswa ngesixhobo sokulinganisa umfanekiso wequadratic. Ekubeni i-PCB luhlobo oluncinci, oluncinci kunye noluthambileyo lwemveliso, umlinganiselo woqhagamshelwano kulula ukuvelisa i-deformation, ekhokelela kumlinganiselo ongachanekanga, kunye nesixhobo sokulinganisa umfanekiso we-dimensional-dimensional ibe sesona sixhobo sokulinganisa i-dimensional ephezulu. Emva kokuba isixhobo sokulinganisa umfanekiso weSirui sicwangcisiwe, sinokuqonda umlinganiselo ozenzekelayo, ongenakho ukuchaneka komlinganiselo ophezulu kuphela, kodwa unciphisa kakhulu ixesha lokulinganisa kunye nokuphucula ukusebenza komlinganiselo.
Ixesha lokuposa: Jan-15-2024
