| IBanga elisemgangathweni | •I-IPC eqhelekileyo 2-3 |
| ITekhnoloji yeNdibano | • Iistensile ze-SMD •Ukwenziwa kwePCB • INdibano ye-SMT PCB • THTindibano • INdibano yokuXhasa ikhebula nocingo • NgokusesikweniUkwaleka • Iindibano zeNdibaniselwano yabasebenzisi • Ukwakhiwa kwebhokisiINdibano • Okokugqibelaindibano yemveliso |
| Iinkonzo ezongeziweyo zexabiso | • Ukufumana icandelo • Ukupakishwa nokuhanjiswa • I-DFM • Ukupakishwa kunyeukuhanjiswa • Isampulu yePCBA • Sebenza kwakhona • Inkqubo ye-IC • Ingxelo ye-NPI |
| Izatifikethi zeNkampani | • ISO9001 • IATF16949 • ISO13485 • 14001 |
| Izatifikethi zeMveliso | • UL • RoHS • SGS • FIKA |
| Umthamo weodolo | • Akukho mfuneko ze-MOQ (Ubungakanani boMyalelo ophantsi) |
| Inkqubo yoVavanyo | QC ukuhlolwa ngesandla SPI(Ukuhlolwa kwe-Solder Paste)X-reyi • FAI (inqaku lokuqala ukuhlolwa) ICT FCT Uvavanyo lokuguga Uvavanyo lokuthembeka |
| FOB Port | Shenzhen |
| Ubunzima ngeYunithi nganye | 150.0 iigram |
| Ikhowudi ye-HTS | 3824.99.70 00 |
| Thumela Imilinganiselo yeKhathoni L/W/H | 53.0 x 29.0 x 37.0 Iisentimitha |
| Ixesha lokukhokhela | 14-21 iintsuku |
| Imilinganiselo ngeYunithi nganye | 15.0 x 10.0 x 3.0 Iisentimitha |
| Iiyunithi ngokweKhathoni yokuThumela ngaphandle | 100.0 |
| Thumela Carton Weight | 13.0 Iikhilogram |