IBanga elisemgangathweni | •I-IPC eqhelekileyo 2-3 |
ITekhnoloji yeNdibano | • Iistensile ze-SMD •Ukwenziwa kwePCB • INdibano ye-SMT PCB • THTindibano • INdibano yokuXhasa ikhebula nocingo • NgokusesikweniUkwaleka • Iindibano zeNdibaniselwano yabasebenzisi • Ukwakhiwa kwebhokisiINdibano • Okokugqibelaindibano yemveliso |
Iinkonzo ezongeziweyo zexabiso | • Ukufumana icandelo • Ukupakishwa nokuhanjiswa • I-DFM • Ukupakishwa kunyeukuhanjiswa • Isampulu yePCBA • Sebenza kwakhona • Inkqubo ye-IC • Ingxelo ye-NPI |
Izatifikethi zeNkampani | • ISO9001 • IATF16949 • ISO13485 • 14001 |
Izatifikethi zeMveliso | • UL • RoHS • SGS • FIKA |
Umthamo weodolo | • Akukho mfuneko ze-MOQ (Ubungakanani boMyalelo ophantsi) |
Inkqubo yoVavanyo | QC ukuhlolwa ngesandla SPI(Ukuhlolwa kwe-Solder Paste)X-reyi • FAI (inqaku lokuqala ukuhlolwa) ICT FCT Uvavanyo lokuguga Uvavanyo lokuthembeka |
FOB Port | Shenzhen |
Ubunzima ngeYunithi nganye | 150.0 iigram |
Ikhowudi ye-HTS | 3824.99.70 00 |
Thumela Imilinganiselo yeKhathoni L/W/H | 53.0 x 29.0 x 37.0 Iisentimitha |
Ixesha lokukhokhela | 14-21 iintsuku |
Imilinganiselo ngeYunithi nganye | 15.0 x 10.0 x 3.0 Iisentimitha |
Iiyunithi ngokweKhathoni yokuThumela ngaphandle | 100.0 |
Thumela Carton Weight | 13.0 Iikhilogram |