| Iileya | 1-2 Iileya |
| Ukutyeba okugqityiweyo | 16-134mil (0.4mm-3.4mm) |
| Max. Ubungakanani | 500mm *1200mm |
| Ukutyeba kobhedu | 35um, 70um,1 ukuya 10oZ |
| Ububanzi bomgca obuncinci/iSithuba | 4mil (0.1mm) |
| Ubungakanani boMngxuma obugqityiweyo | 0.95mm |
| Min. Ubungakanani beDrill | 1.00mm |
| Max. Ubungakanani beDrill | 6.5mm |
| Kugqityiwe ukuNyamezelwa koBubungakanani boMngxuma | ±0.050mm |
| Ukuchaneka kweNdawo yokuMvula | ±0.076mm |
| Min SMT PAD Ubungakanani | 0.4mm±0.1mm |
| Min.Solder Mask PAD | 0.05mm(2mil) |
| Min.Solder Mask Cover | 0.05mm(2mil) |
| Solder imaski Ukutyeba | > 12um |
| UkuQeda komphezulu | I-HAL, i-HAL Lead simahla, i-OSP, iGolide yokuntywiliselwa, njl |
| HAL Ukutyeba | 5-12um |
| Ukuntywiliselwa ukutyeba Gold | 1-3mil |
| OSP Film Ukutyeba | I-ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
| UkuGqiba kolwandlalo | Indlela & Ukubetha; Ukutenxa ngokuchanekileyo ±0.10mm |
| I-Thermal Conductivity | 1.0 ukuya kwi-12w/mk |
| FOB Port | Shenzhen |
| Thumela Imilinganiselo yeKhathoni L/W/H | 36 x 26 x 25 iisentimitha |
| Ixesha lokukhokhela | 3-7 iintsuku |
| Iiyunithi ngokweKhathoni yokuThumela ngaphandle | 5.0 |
| Thumela Carton Weight | Iikhilogram ezili-18 |