Iileya | 1-2 Iileya |
Ukutyeba okugqityiweyo | 16-134mil (0.4mm-3.4mm) |
Max. Ubungakanani | 500mm *1200mm |
Ukutyeba kobhedu | 35um, 70um,1 ukuya 10oZ |
Ububanzi bomgca obuncinci/iSithuba | 4mil (0.1mm) |
Ubungakanani boMngxuma obugqityiweyo | 0.95mm |
Min. Ubungakanani beDrill | 1.00mm |
Max. Ubungakanani beDrill | 6.5mm |
Kugqityiwe ukuNyamezelwa koBubungakanani boMngxuma | ±0.050mm |
Ukuchaneka kweNdawo yokuMvula | ±0.076mm |
Min SMT PAD Ubungakanani | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm(2mil) |
Min.Solder Mask Cover | 0.05mm(2mil) |
Solder imaski Ukutyeba | > 12um |
UkuQeda komphezulu | I-HAL, i-HAL Lead simahla, i-OSP, iGolide yokuntywiliselwa, njl |
HAL Ukutyeba | 5-12um |
Ukuntywiliselwa ukutyeba Gold | 1-3mil |
OSP Film Ukutyeba | I-ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
UkuGqiba kolwandlalo | Indlela & Ukubetha; Ukutenxa ngokuchanekileyo ±0.10mm |
I-Thermal Conductivity | 1.0 ukuya kwi-12w/mk |
FOB Port | Shenzhen |
Thumela Imilinganiselo yeKhathoni L/W/H | 36 x 26 x 25 iisentimitha |
Ixesha lokukhokhela | 3-7 iintsuku |
Iiyunithi ngokweKhathoni yokuThumela ngaphandle | 5.0 |
Thumela Carton Weight | Iikhilogram ezili-18 |