Inkqubo yemveliso ye-PCBA eneenkcukacha (kubandakanywa nenkqubo ye-SMT), yiza kwaye ubone!
01."UkuHamba kweNkqubo ye-SMT"
I-Reflow welding ibhekiselele kwinkqubo yokuqhafaza ethambileyo eqonda uqhagamshelo lomatshini kunye nombane phakathi kokuphela kwe-welding yecandelo elidityaniswe phezulu okanye i-pin kunye ne-PCB pad ngokunyibilikisa i-solder paste eprintwe kwangaphambili kwi-PCB pad. Inkqubo yokuhamba yile: ukuprinta i-solder paste - patch - reflow welding, njengoko kubonisiwe kumzobo ongezantsi.
1. Ukuprintwa kwe-solder paste
Injongo kukusebenzisa isixa esifanelekileyo se-solder paste ngokulinganayo kwi-solder pad ye-PCB ukuqinisekisa ukuba amacandelo e-patch kunye ne-pad ye-solder ehambelanayo ye-PCB i-reflow welded ukuphumeza uqhagamshelo olulungileyo lombane kunye namandla aneleyo omatshini. Indlela yokuqinisekisa ukuba i-solder paste isetyenziswe ngokulinganayo kwi-pad nganye? Kufuneka senze umnatha wentsimbi. I-solder paste ifakwe ngokulinganayo kwi-solder nganye phantsi kwesenzo se-scraper ngokusebenzisa imingxuma ehambelanayo kwi-mesh yensimbi. Imizekelo ye-steel mesh diagram iboniswe kulo mfanekiso ulandelayo.
Umzobo wokuprinta we-Solder uboniswe kulo mfanekiso ulandelayo.
Iprinta ye-solder eprintiweyo yePCB iboniswe kulo mfanekiso ulandelayo.
2. Isiqwenga
Le nkqubo kukusebenzisa umatshini wokunyuka ukunyusa ngokuchanekileyo amacandelo e-chip kwindawo ehambelanayo kwi-PCB yomhlaba we-solder eprintiweyo yokunamathisela okanye i-patch glue.
Oomatshini be-SMT banokohlulwa babe ziindidi ezimbini ngokwemisebenzi yabo:
Umatshini ohamba ngesantya esiphezulu: ulungele ukunyuswa kwenani elikhulu lamacandelo amancinci: njengama-capacitors, i-resistors, njl.
B Umatshini wendalo yonke: ulungele ukunyuswa kwesini esahlukileyo okanye amacandelo achanekileyo aphezulu: njenge-QFP, i-BGA, i-SOT, i-SOP, i-PLCC kunye nokunye.
Umzobo wesixhobo somatshini we-SMT uboniswe kulo mfanekiso ulandelayo.
I-PCB emva kwepetshi iboniswe kulo mzobo ulandelayo.
3. Reflow welding
I-Reflow Soldring yinguqulelo ethe ngqo ye-English Reflow soldring, eyi-mechanical ne-electrical connection phakathi kwe-surface assembly components kunye ne-PCB solder pad ngokunyibilikisa i-solder paste kwi-solder board solder pad, eyenza isiphaluka sombane.
Ukugqithiswa kwe-welding yinkqubo ephambili kwimveliso ye-SMT, kwaye ukusetwa kwe-curve yeqondo lokushisa okufanelekileyo kungundoqo wokuqinisekisa umgangatho wokubuyisela kwakhona i-welding. Amajiko obushushu angafanelekanga aya kubangela iziphene ze-PCB ze-welding ezifana ne-welding engagqibekanga, i-welding virtual, i-component warping, kunye neebhola ze-solder ezigqithisileyo, eziya kuchaphazela umgangatho wemveliso.
Umzobo wesixhobo somlilo we-welding we-reflow uboniswe kulo mfanekiso ulandelayo.
Emva kwesithando somlilo, i-PCB egqitywe ngokuphinda ifakwe i-welding iboniswe kumzobo ongezantsi.
