Imoto yokutshaja imfumba yebhodi yolawulo yebhodi ye-SMT yetshiphu yokusetyenzwa kwe-PCBA Ukutshaja imfumba yesisombululo sebhodi umenzi obonakalayo

Car ukutshaja imfumba motherboard ibhodi yolawulo SMT chip processing PCBA Ukutshaja imfumba isisombululo ibhodi yesekethe umenzi

Inkcazelo emfutshane:

I-motherboard ye-PCBA ye-motherboard ye-motherboard yeyona nto isetyenziselwa ukulawula ukutshaja kwemfumba.
Inemisebenzi eyahlukeneyo. Nantsi intshayelelo emfutshane yeempawu zayo eziphambili:
Amandla okusebenza okunamandla: I-motherboard ye-PCBA ixhotyiswe nge-microprocessor ephezulu yokusebenza, enokukhawuleza ukuphatha imisebenzi eyahlukeneyo yokulawula ukutshaja kwaye iqinisekise ukhuseleko kunye nokuzinza kwenkqubo yokutshaja.
Uyilo olutyebileyo lwe-interface: I-PCBA motherboard inikezela ngeendlela ezahlukeneyo zokujongana, ezifana nojongano lwamandla, i-interfaces yonxibelelwano, njl., ezinokuhlangabezana nokuhanjiswa kwedatha kunye neemfuno zokusebenzisana komqondiso phakathi kweemfumba zokutshaja, izithuthi kunye nezinye izixhobo.
Ulawulo lokutshaja olukrelekrele: I-PCBA motherboard inokulawula ngobukrelekrele ukutshaja kwangoku kunye nevoltage ngokwemo yamandla ebhetri kunye neemfuno zokutshaja ukunqanda ukutshaja kakhulu okanye ukutshaja ngaphantsi, ukwandisa ngokufanelekileyo ubomi bebhetri.
Gqibezela imisebenzi yokhuseleko: I-motherboard ye-PCBA idibanisa imisebenzi eyahlukeneyo yokhuseleko, njengokhuseleko lwangoku, ukukhuselwa kwe-voltage, ukhuseleko olungaphantsi kwe-voltage, njl. ukusebenza okuqhelekileyo kwenkqubo. Ukhuseleko lwenkqubo yokutshaja.
Ukugcinwa kwamandla kunye nokukhuselwa kokusingqongileyo: I-motherboard ye-PCBA ithatha uyilo lokugcina amandla, olunokulungelelanisa umbane wangoku kunye nombane ngokweemfuno zokwenene, ukunciphisa ngokufanelekileyo ukusetyenziswa kwamandla kunye nokunciphisa impembelelo kokusingqongileyo.
Ukuyigcina kulula kwaye kuphuculwe: I-PCBA motherboard ine-scalability elungileyo kunye nokuhambelana, eyenza kube lula ukugcinwa kunye nokuphucula emva kwexesha, kwaye inokuziqhelanisa neenguqu kwiimodeli ezahlukeneyo kunye neemfuno ezahlukeneyo zokutshaja.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukubonakaliswa kwezakhono zenkqubo:
1. Ubukhulu bepleyiti:
0.3MM ~ 3.0MM (ubuncinci be-0.15mm, ubukhulu obukhulu bungenziwa ngokweemfuno zabathengi)
2. I-Inki:
Ioli eluhlaza, ioli eluhlaza, ioli emnyama, ioli emhlophe, ibhotela ioli ebomvu, i-purple, i-matte emnyama
3. Itekhnoloji yoMphezulu: I-Anti-oxidation (SOP), isitshizi setoti ehamba phambili, isitshizi setoti esingenalothe, igolide yokuntywiliselwa, igolide yokubeka, isilivere, i-nickel plating, umnwe wegolide,imotoioli yebhon
4. Itekhnoloji ekhethekileyo: ibhodi ye-impedance, ibhodi ye-high frequency, ibhodi engcwatywe umngxuma oyimfama (ubuncinci umngxuma 0.1mm laser hole)

Imodeli: yenziwe ngokwezifiso
Inani leemveliso zeemveliso: i-multi-layer
Izinto zokugquma: i-organic resin
Ukusebenza kwe-Flame retardant: Ibhodi ye-VO
Izinto zokuqinisa: isiseko selaphu le-fiberglass
Ukuqina komatshini: ngqongqo
Izinto eziphathekayo: ubhedu
I-insulation layer thick: ipleyiti encinci
Iteknoloji yokucubungula: Ifoyile yekhalenda
Insulating resin: polyimide resin (PI)
Inani lemigangatho yemveliso: 1 ~ 10 iileya
Ubungakanani obukhulu: 600X600mm
Ubuncinci besayizi: ± 0.15mm
Ukunyamezela kweLayman: 0.4 ~ 3.2mm
Ubungqingqwa bepleyiti: ±10%
Ububanzi bomgca womgca webhodi: 5MIL (0.127mm)
Umgama womda womgca webhodi: 5MIL (0.127mm)
Ubunzima bobhedu obugqityiweyo: 1OZ (35UM)
Ukwemba oomatshini: 0.25 ~ 6.3mm
Ukunyamezela kwe-Aperture: ± 0.075mm
Ubuncinane bonobumba: ububanzi ≥ 0.15mm/ubude ≥ 0.85n
Umgama ukusuka kumgca ukuya kulwandlalo: ≥12MIL (0.3mm)
Uhlobo lwemaski yeSolder: I-inki ye-photosensitive/imatte
Akukho phaneli yesithuba: Omm
Isithuba sephaneli: 1.5mm
Inkonzo enye yePCBA, ukuhanjiswa ngokukhawuleza.